Memory Connectors - PC Card Sockets

Image Part Number Description / PDF Quantity Rfq
0538565070

0538565070

Woodhead - Molex

CONN COMPACT FLASH CARD R/A SMD

0

0679130002

0679130002

Woodhead - Molex

CONN SD CARD PUSH-PUSH R/A SMD

0

0473220003

0473220003

Woodhead - Molex

CONN PCMCIA CARD PUSH-PUSH

0

0671550001

0671550001

Woodhead - Molex

CONN COMPACT FLASH CARD R/A SMD

0

0912283002

0912283002

Woodhead - Molex

CONN SIM CARD PUSH-PUSH R/A SMD

0

5031820852

5031820852

Woodhead - Molex

CONN MICRO SD CARD PUSH-PUSH R/A

0

0552445029

0552445029

Woodhead - Molex

CONN COMPACT FLASH CARD R/A SMD

0

0496191611

0496191611

Woodhead - Molex

CONN MICRO SD/SIM CARD PUSH-PUSH

0

0942080011

0942080011

Woodhead - Molex

CONN PCMCIA CARD PUSH-PULL PCB

0

0471500003

0471500003

Woodhead - Molex

CONN PCMCIA CARD PUSH-PUSH

0

0539275019

0539275019

Woodhead - Molex

CONN COMPACT FLASH CARD R/A SMD

0

0676008002

0676008002

Woodhead - Molex

CONN SD CARD PUSH-PUSH R/A SMD

0

0550220001

0550220001

Woodhead - Molex

CONN COMPACT FLASH CARD SNAP-IN

0

0492250821

0492250821

Woodhead - Molex

CONN MICRO SD CARD PUSH-PUSH R/A

0

5031821853

5031821853

Woodhead - Molex

CONN MICRO SD CARD PUSH-PUSH R/A

0

0475350001

0475350001

Woodhead - Molex

CONN SIM CRD W/DOME CONTACTS SMD

0

1050481001

1050481001

Woodhead - Molex

CONN SIM CARD PUSH-PULL R/A SMD

0

0473220002

0473220002

Woodhead - Molex

CONN PCMCIA CARD PUSH-PULL R/A

0

0473883001

0473883001

Woodhead - Molex

CONN SIM CARD HINGED TYPE R/A

0

0473080001

0473080001

Woodhead - Molex

CONN SIM CARD PUSH-PULL R/A SMD

0

Memory Connectors - PC Card Sockets

1. Overview

PC Card Sockets (Personal Computer Memory Card International Association Sockets) are standardized expansion interfaces for connecting peripheral devices to computing systems. Defined by the PCMCIA standard, these connectors enable hot-swappable integration of memory modules, storage devices, network adapters, and other functional components. Their compact form factor and universal compatibility have made them critical in portable electronics, industrial equipment, and embedded systems.

2. Main Types and Functional Classification

TypePhysical Dimensions (mm)Functional FeaturesApplication Examples
Type I54 85.6 3.316-bit ISA bus, 68-pinMemory expansion cards
Type II54 85.6 5.016/32-bit bus supportModem, LAN adapters
Type III54 85.6 10.532-bit CardBus interfaceHard disk drives
ExpressCard54 75 5.0 or 34 75 5.0PCIe/GPIO interface, 26-pinHigh-speed SSD interfaces

3. Structure and Components

Typical PC card sockets consist of:

  • Dielectric Housing: High-temperature resistant LCP material
  • Contact Array: Gold-plated phosphor bronze contacts (10-30 m plating)
  • Actuation Mechanism: Ejector levers with tactile feedback
  • Locking System: Mechanical retention springs
  • EMI Shielding: Integrated metal cans (0.1-0.3mm thickness)
The contact pitch typically measures 1.27mm with 0.8mm contact spacing, supporting blind-mating designs.

4. Key Technical Specifications

ParameterTypical ValueImportance
Contact Resistance10-30m Signal integrity maintenance
Current Rating1.0A per contactPower delivery capability
Dielectric Withstand1000VACElectrical safety compliance
Operating Temperature-55 C to +85 CEnvironmental reliability
Mating Cycles10,000+Durability indicator

5. Application Fields

Primary industries include:

  • Consumer Electronics: Notebook computers, digital cameras
  • Industrial Automation: Programmable logic controllers (PLCs)
  • Medical Devices: Portable diagnostic equipment
  • Telecommunications: Wireless base stations
  • Military/Aerospace: Ruggedized computing systems
Case Example: Siemens industrial PCs use Type III sockets for CFast storage modules in factory automation systems.

6. Leading Manufacturers and Products

ManufacturerKey Product SeriesTechnical Features
Amphenol ICC515 SeriesLow-profile Type II sockets
Molex47220 SeriesCardBus compatible
TE Connectivity1-1461885ExpressCard 34mm design
SamtecASP-200404High-speed differential pairs

7. Selection Guidelines

Key considerations:

  • Interface Compatibility: Match bus type (16-bit/32-bit/CardBus/PCIe)
  • Current Capacity: Verify power requirements (e.g., 3.3V/5V support)
  • Vibration Resistance: Select locking mechanisms for mobile applications
  • Thermal Management: Evaluate current carrying capacity under load
  • RoHS Compliance: Confirm lead-free termination options
Best Practice: For industrial applications, specify extended temperature (-40 C to +85 C) socket designs.

8. Industry Trends

Current development directions:

  • Miniaturization: Transition from PCMCIA to ExpressCard/USB4 form factors
  • Speed Enhancement: Support for PCIe Gen4 (16GT/s) protocols
  • Multi-functionality: Integrated power/signal contacts
  • Material Innovation: Graphene-enhanced contact plating
  • Standard Evolution: Migration towards USB4/Thunderbolt compatibility
Market forecasts predict sustained demand in industrial sectors despite consumer market decline.

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