Memory Connectors - PC Card Sockets

Image Part Number Description / PDF Quantity Rfq
0785260001

0785260001

Woodhead - Molex

CONN SIM CARD PUSH-PUSH R/A SMD

68693

0475710001

0475710001

Woodhead - Molex

CONN MICRO SD CARD PUSH-PULL R/A

782

0912283006

0912283006

Woodhead - Molex

CONN SIM CARD PUSH-PUSH R/A SMD

200

5033981892

5033981892

Woodhead - Molex

MICRO SD PUSH/PUSH SMALL 8C

14822

1040310811

1040310811

Woodhead - Molex

CONN MICRO SD CARD PUSH-PULL R/A

9487

0912283007

0912283007

Woodhead - Molex

CONN SIM CARD PUSH-PUSH R/A SMD

1016

5031821852

5031821852

Woodhead - Molex

MICRO SD NORMAL ULTRALOWPRO8CKTE

25526

1051620101

1051620101

Woodhead - Molex

1.45H MICRO SD HEADER WITH D/C P

2135

5045200691

5045200691

Woodhead - Molex

NANO-SIM CARD CONNECTOR, PIN-EJE

12284

1042391430

1042391430

Woodhead - Molex

MSD/NSIM COMBO 2.05H PULLER TYPE

5257

0475500001

0475500001

Woodhead - Molex

CONN SIM CARD BLOCK STYLE SMD

17364

5009010801

5009010801

Woodhead - Molex

CONN MICRO SD CARD HINGED TYPE

12198

1041681620

1041681620

Woodhead - Molex

MICROSDMICROSIM COMBO 228H SW 8P

17509

0539275078

0539275078

Woodhead - Molex

CONN COMPACT FLASH CARD R/A SMD

0

5039600694

5039600694

Woodhead - Molex

CONN MICRO SIMM PUSH-PUSH R/A

8606

5039600695

5039600695

Woodhead - Molex

CONN MICRO SIMM PUSH-PUSH R/A

3742

0892640000

0892640000

Woodhead - Molex

CONN MEMORY CARD HDR

0

0470192002

0470192002

Woodhead - Molex

CONN SIM CARD PUSH-PULL R/A SMD

8881

5031821832

5031821832

Woodhead - Molex

MICRO SD NORMAL ULTRALOWPRO8CKTE

0

1510730001

1510730001

Woodhead - Molex

NANOSIM CONN WTRAY DP 132MMHT

0

Memory Connectors - PC Card Sockets

1. Overview

PC Card Sockets (Personal Computer Memory Card International Association Sockets) are standardized expansion interfaces for connecting peripheral devices to computing systems. Defined by the PCMCIA standard, these connectors enable hot-swappable integration of memory modules, storage devices, network adapters, and other functional components. Their compact form factor and universal compatibility have made them critical in portable electronics, industrial equipment, and embedded systems.

2. Main Types and Functional Classification

TypePhysical Dimensions (mm)Functional FeaturesApplication Examples
Type I54 85.6 3.316-bit ISA bus, 68-pinMemory expansion cards
Type II54 85.6 5.016/32-bit bus supportModem, LAN adapters
Type III54 85.6 10.532-bit CardBus interfaceHard disk drives
ExpressCard54 75 5.0 or 34 75 5.0PCIe/GPIO interface, 26-pinHigh-speed SSD interfaces

3. Structure and Components

Typical PC card sockets consist of:

  • Dielectric Housing: High-temperature resistant LCP material
  • Contact Array: Gold-plated phosphor bronze contacts (10-30 m plating)
  • Actuation Mechanism: Ejector levers with tactile feedback
  • Locking System: Mechanical retention springs
  • EMI Shielding: Integrated metal cans (0.1-0.3mm thickness)
The contact pitch typically measures 1.27mm with 0.8mm contact spacing, supporting blind-mating designs.

4. Key Technical Specifications

ParameterTypical ValueImportance
Contact Resistance10-30m Signal integrity maintenance
Current Rating1.0A per contactPower delivery capability
Dielectric Withstand1000VACElectrical safety compliance
Operating Temperature-55 C to +85 CEnvironmental reliability
Mating Cycles10,000+Durability indicator

5. Application Fields

Primary industries include:

  • Consumer Electronics: Notebook computers, digital cameras
  • Industrial Automation: Programmable logic controllers (PLCs)
  • Medical Devices: Portable diagnostic equipment
  • Telecommunications: Wireless base stations
  • Military/Aerospace: Ruggedized computing systems
Case Example: Siemens industrial PCs use Type III sockets for CFast storage modules in factory automation systems.

6. Leading Manufacturers and Products

ManufacturerKey Product SeriesTechnical Features
Amphenol ICC515 SeriesLow-profile Type II sockets
Molex47220 SeriesCardBus compatible
TE Connectivity1-1461885ExpressCard 34mm design
SamtecASP-200404High-speed differential pairs

7. Selection Guidelines

Key considerations:

  • Interface Compatibility: Match bus type (16-bit/32-bit/CardBus/PCIe)
  • Current Capacity: Verify power requirements (e.g., 3.3V/5V support)
  • Vibration Resistance: Select locking mechanisms for mobile applications
  • Thermal Management: Evaluate current carrying capacity under load
  • RoHS Compliance: Confirm lead-free termination options
Best Practice: For industrial applications, specify extended temperature (-40 C to +85 C) socket designs.

8. Industry Trends

Current development directions:

  • Miniaturization: Transition from PCMCIA to ExpressCard/USB4 form factors
  • Speed Enhancement: Support for PCIe Gen4 (16GT/s) protocols
  • Multi-functionality: Integrated power/signal contacts
  • Material Innovation: Graphene-enhanced contact plating
  • Standard Evolution: Migration towards USB4/Thunderbolt compatibility
Market forecasts predict sustained demand in industrial sectors despite consumer market decline.

RFQ BOM Call Skype Email
Top