ample-chip ample-chip
RFQ
BOM

FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0528081170

0528081170

Woodhead - Molex

CONN FPC VERT 11POS 1.00MM SMD

7722
2005290090

2005290090

Woodhead - Molex

1.0 FPC ZIF BTM CONT EMBT PKG 9C

17233
2004850530

2004850530

Woodhead - Molex

0.5 ONE-TOUCH ST 30P

0
0512964033

0512964033

Woodhead - Molex

CONN FFC BOTTOM 40POS 0.50MM R/A

4785
0528080871

0528080871

Woodhead - Molex

CONN FFC FPC VERT 8POS 1MM SMD

0
0015474077

0015474077

Woodhead - Molex

CONN CIC FFC RCPT 7POS 2.54MM

2875
0522712079

0522712079

Woodhead - Molex

CONN FPC BOTTOM 20POS 1.00MM R/A

199
0522070733

0522070733

Woodhead - Molex

CONN FFC FPC TOP 7POS 1.00MM R/A

5692
5027903091

5027903091

Woodhead - Molex

CONN FPC BOTTOM 30POS 0.50MM R/A

3938
0525591552

0525591552

Woodhead - Molex

CONN FFC VERT 15POS 0.50MM SMD

4805
0526102233

0526102233

Woodhead - Molex

CONN FPC VERT 22POS 1.00MM SMD

2800
5051105091

5051105091

Woodhead - Molex

CONN FFC/FPC BOTTOM 50P .5MM R/A

62
0522072060

0522072060

Woodhead - Molex

CONN FFC FPC TOP 20POS 1MM R/A

5799
0514411072

0514411072

Woodhead - Molex

CONN FFC BOTTOM 10POS 0.50MM R/A

2523
0039532074

0039532074

Woodhead - Molex

CONN FFC FPC TOP 7POS 1.25MM R/A

0
0522710579

0522710579

Woodhead - Molex

CONN FPC BOTTOM 5POS 1.00MM R/A

5394
5019515000

5019515000

Woodhead - Molex

CONN FFC VERT 50POS 0.50MM SMD

2393
0528073010

0528073010

Woodhead - Molex

CONN FPC TOP 30POS 1.00MM R/A

4865
0543931781

0543931781

Woodhead - Molex

CONN FPC BOTTOM 17POS 0.30MM R/A

0
0528082370

0528082370

Woodhead - Molex

CONN FPC VERT 23POS 1.00MM SMD

453

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
RFQ BOM Call Skype Email
Top