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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0527452033

0527452033

Woodhead - Molex

CONN FFC TOP 20POS 0.50MM R/A

5939
0015474030

0015474030

Woodhead - Molex

CONN CIC FFC RCPT 3POS 2.54MM

0
0545501033

0545501033

Woodhead - Molex

CONN FFC TOP 10POS 0.50MM R/A

10558
0522712869

0522712869

Woodhead - Molex

CONN FPC BOTTOM 28POS 1.00MM R/A

1705
0512812094

0512812094

Woodhead - Molex

CONN FFC FPC 20POS 0.50MM R/A

8231
0522711569

0522711569

Woodhead - Molex

CONN FPC BOTTOM 15POS 1.00MM R/A

4623
0039532114

0039532114

Woodhead - Molex

CONN FFC TOP 11POS 1.25MM R/A

937
0522711779

0522711779

Woodhead - Molex

CONN FPC BOTTOM 17POS 1.00MM R/A

4126
5051101692

5051101692

Woodhead - Molex

CONN FPC BOTTOM 16POS .5MM R/A

0
0522710869

0522710869

Woodhead - Molex

CONN FPC BOTTOM 8POS 1.00MM R/A

30
0528080971

0528080971

Woodhead - Molex

CONN FFC FPC VERT 9POS 1MM SMD

6672
0527450497

0527450497

Woodhead - Molex

CONN FFC TOP 4POS 0.50MM R/A

9991
0528082771

0528082771

Woodhead - Molex

CONN FFC FPC VERT 27POS 1MM SMD

2
5051107091

5051107091

Woodhead - Molex

CONN FFC/FPC BOTTOM 70P .5MM R/A

32
5051100992

5051100992

Woodhead - Molex

CONN FPC BOTTOM 9POS .5MM R/A

490
5052780833

5052780833

Woodhead - Molex

0.5 FFC ZIF BTM CONT EMBT PKG 8C

1837
0526101333

0526101333

Woodhead - Molex

CONN FPC VERT 13POS 1.00MM SMD

1808
0512966094

0512966094

Woodhead - Molex

CONN FFC BOTTOM 60POS 0.50MM R/A

8813
0527930770

0527930770

Woodhead - Molex

CONN FPC TOP 7POS 1.00MM R/A

6570
0015388030

0015388030

Woodhead - Molex

CONN CIC FFC RCPT 3POS 2.54MM

1895

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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