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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0512810694

0512810694

Woodhead - Molex

CONN FFC FPC 6POS 0.50MM R/A

17498
0039532264

0039532264

Woodhead - Molex

CONN FFC TOP 26POS 1.25MM R/A

0
0528082271

0528082271

Woodhead - Molex

CONN FFC FPC VERT 22POS 1MM SMD

1798
5035662100

5035662100

Woodhead - Molex

CONN FPC BOTTOM 21POS 0.30MM R/A

35
0522071533

0522071533

Woodhead - Molex

CONN FFC FPC TOP 15POS 1MM R/A

2429
0525594033

0525594033

Woodhead - Molex

CONN FFC VERT 40POS 0.50MM SMD

2199
0039532254

0039532254

Woodhead - Molex

CONN FFC TOP 25POS 1.25MM R/A

4
0015389032

0015389032

Woodhead - Molex

CONN CIC FFC PLUG 3POS 2.54MM

0
0522071860

0522071860

Woodhead - Molex

CONN FFC FPC TOP 18POS 1MM R/A

3641
5025982793

5025982793

Woodhead - Molex

CONN FPC 27POS 0.30MM R/A

16860
0522710769

0522710769

Woodhead - Molex

CONN FPC BOTTOM 7POS 1.00MM R/A

14396
0528081271

0528081271

Woodhead - Molex

CONN FFC FPC VERT 12POS 1MM SMD

812
0522712579

0522712579

Woodhead - Molex

CONN FPC BOTTOM 25POS 1.00MM R/A

0
0541323562

0541323562

Woodhead - Molex

CONN FFC BOTTOM 35POS 0.50MM R/A

4465
5052782433

5052782433

Woodhead - Molex

0.5 FFC ZIF BTM CONT EMBT PKG 24

706
0524352171

0524352171

Woodhead - Molex

CONN FFC TOP 21POS 0.50MM R/A

124
0541323062

0541323062

Woodhead - Molex

CONN FFC BOTTOM 30POS 0.50MM R/A

3
0524352971

0524352971

Woodhead - Molex

CONN FFC TOP 29POS 0.50MM R/A

3844
0526102433

0526102433

Woodhead - Molex

CONN FPC VERT 24POS 1.00MM SMD

927
0528061310

0528061310

Woodhead - Molex

CONN FPC VERT 13POS 1.00MM PCB

11

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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