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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0541324562

0541324562

Woodhead - Molex

CONN FFC BOTTOM 45POS 0.50MM R/A

39739000
0015474033

0015474033

Woodhead - Molex

CONN FFC CIC RCPT 3POS 2.54MM

2428
5051106491

5051106491

Woodhead - Molex

CONN FFC/FPC BOTTOM 64P .5MM R/A

5930
0525590853

0525590853

Woodhead - Molex

CONN FFC VERT 8POS 0.50MM SMD

0
0526101833

0526101833

Woodhead - Molex

CONN FPC VERT 18POS 1.00MM SMD

1186
0524372171

0524372171

Woodhead - Molex

CONN FFC BOTTOM 21POS 0.50MM R/A

124
5027908091

5027908091

Woodhead - Molex

CONN FPC BOTTOM 80POS 0.50MM R/A

4000
2004850520

2004850520

Woodhead - Molex

0.5 ONE-TOUCH ST 20P

6000
0527931870

0527931870

Woodhead - Molex

CONN FPC TOP 18POS 1.00MM R/A

8826
0522711169

0522711169

Woodhead - Molex

10 FPCZIFSMTRABTMAU11CKTEMBSTPPK

5013
0512965094

0512965094

Woodhead - Molex

CONN FFC BOTTOM 50POS 0.50MM R/A

79
0520450445

0520450445

Woodhead - Molex

CONN FFC VERT 4POS 1.25MM PCB

678
0522711079

0522711079

Woodhead - Molex

CONN FPC BOTTOM 10POS 1.00MM R/A

46
0545502171

0545502171

Woodhead - Molex

CONN FFC TOP 21POS 0.50MM R/A

704
0528071610

0528071610

Woodhead - Molex

CONN FPC TOP 16POS 1.00MM R/A

151
5007971594

5007971594

Woodhead - Molex

CONN FPC BOTTOM 15POS 0.30MM R/A

773
0545500571

0545500571

Woodhead - Molex

CONN FFC FPC TOP 5POS 0.50MM R/A

43695
0525592234

0525592234

Woodhead - Molex

CONN FFC VERT 22POS 0.50MM SMD

4212
0527462033

0527462033

Woodhead - Molex

CONN FFC BOTTOM 20POS 0.50MM R/A

749
0541324362

0541324362

Woodhead - Molex

CONN FFC BOTTOM 43POS 0.50MM R/A

0

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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