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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0522071460

0522071460

Woodhead - Molex

CONN FFC FPC TOP 14POS 1MM R/A

4980
0545500833

0545500833

Woodhead - Molex

CONN FFC FPC TOP 8POS 0.50MM R/A

13489
5019517010

5019517010

Woodhead - Molex

CONN FFC VERT 70POS 0.50MM SMD

164
0528520470

0528520470

Woodhead - Molex

CONN FFC BOTTOM 4POS 1.00MM R/A

17786
5035661700

5035661700

Woodhead - Molex

CONN FPC BOTTOM 17POS 0.30MM R/A

7145
0039532145

0039532145

Woodhead - Molex

CONN FFC VERT 14POS 1.25MM PCB

1689
5034800600

5034800600

Woodhead - Molex

CONN FFC FPC 6POS 0.50MM R/A

76453
0525592034

0525592034

Woodhead - Molex

CONN FFC VERT 20POS 0.50MM SMD

3754
0528522670

0528522670

Woodhead - Molex

CONN FFC BOTTOM 26POS 1.00MM R/A

2246
5034802200

5034802200

Woodhead - Molex

CONN FFC FPC 22POS 0.50MM R/A

12699
5033666011

5033666011

Woodhead - Molex

CONN FFC BOTTOM 60POS 0.50MM R/A

1298
0528082570

0528082570

Woodhead - Molex

CONN FPC VERT 25POS 1.00MM SMD

0
0545500471

0545500471

Woodhead - Molex

CONN FFC FPC TOP 4POS 0.50MM R/A

3446
5042811900

5042811900

Woodhead - Molex

CONN FPC 19POS 0.30MM R/A

0
0528082670

0528082670

Woodhead - Molex

CONN FPC VERT 26POS 1.00MM SMD

5279
5034802000

5034802000

Woodhead - Molex

CONN FFC FPC 20POS 0.50MM R/A

8750
0528071810

0528071810

Woodhead - Molex

CONN FPC TOP 18POS 1.00MM R/A

6233
5025983993

5025983993

Woodhead - Molex

CONN FPC 39POS 0.30MM R/A

22188
0527450833

0527450833

Woodhead - Molex

CONN FFC FPC TOP 8POS 0.50MM R/A

7680
0525590952

0525590952

Woodhead - Molex

CONN FFC VERT 9POS 0.50MM SMD

5489

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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