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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
5027905091

5027905091

Woodhead - Molex

CONN FPC BOTTOM 50POS 0.50MM R/A

4960
0541323662

0541323662

Woodhead - Molex

CONN FFC BOTTOM 36POS 0.50MM R/A

3756
0527930570

0527930570

Woodhead - Molex

CONN FPC TOP 5POS 1.00MM R/A

17585
5019513010

5019513010

Woodhead - Molex

CONN FFC VERT 30POS 0.50MM SMD

52727
5051106091

5051106091

Woodhead - Molex

CONN FFC/FPC BOTTOM 60P .5MM R/A

4222
5035664102

5035664102

Woodhead - Molex

CONN FPC BOTTOM 0.30MM

0
0528062410

0528062410

Woodhead - Molex

CONN FPC VERT 24POS 1.00MM PCB

4729
0512811694

0512811694

Woodhead - Molex

CONN FFC FPC 16POS 0.50MM R/A

15062
2051950360

2051950360

Woodhead - Molex

0.5 FFC VERTICAL 2ROW PLUG ASSY

0
5018645090

5018645090

Woodhead - Molex

CONN FFC BOTTOM 50POS 0.50MM R/A

0
2004850420

2004850420

Woodhead - Molex

0.5 ONE-TOUCH RA 20P

7500
0039532154

0039532154

Woodhead - Molex

CONN FFC TOP 15POS 1.25MM R/A

4403
0545501871

0545501871

Woodhead - Molex

CONN FFC TOP 18POS 0.50MM R/A

357
0526100833

0526100833

Woodhead - Molex

CONN FPC VERT 8POS 1.00MM SMD

1156
0528922033

0528922033

Woodhead - Molex

CONN FFC BOTTOM 20POS 0.50MM R/A

7677
0512965494

0512965494

Woodhead - Molex

CONN FFC BOTTOM 54POS 0.50MM R/A

4889
0527461871

0527461871

Woodhead - Molex

CONN FFC BOTTOM 18POS 0.50MM R/A

209
0528063010

0528063010

Woodhead - Molex

CONN FPC VERT 30POS 1.00MM PCB

7432
5018648090

5018648090

Woodhead - Molex

CONN FFC BOTTOM 80POS 0.50MM R/A

246
0528060310

0528060310

Woodhead - Molex

CONN FPC VERT 3POS 1.00MM PCB

15750

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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