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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0520450845

0520450845

Woodhead - Molex

CONN FFC VERT 8POS 1.25MM PCB

1153
5034800400

5034800400

Woodhead - Molex

CONN FFC FPC 4POS 0.50MM R/A

47810
0545481371

0545481371

Woodhead - Molex

CONN FFC BOTTOM 13POS 0.50MM R/A

974
0526101872

0526101872

Woodhead - Molex

CONN FPC VERT 18POS 1.00MM SMD

3903
0522070860

0522070860

Woodhead - Molex

CONN FFC FPC TOP 8POS 1.00MM R/A

12524
0526100872

0526100872

Woodhead - Molex

CONN FPC VERT 8POS 1.00MM SMD

19248
0545481671

0545481671

Woodhead - Molex

CONN FFC BOTTOM 16POS 0.50MM R/A

2111
0039532035

0039532035

Woodhead - Molex

CONN FFC VERT 3POS 1.25MM PCB

7647
0545480533

0545480533

Woodhead - Molex

CONN FFC BOTTOM 5POS 0.5MM R/A

8028
0526102672

0526102672

Woodhead - Molex

CONN FPC VERT 26POS 1.00MM SMD

525
0527451497

0527451497

Woodhead - Molex

CONN FFC TOP 14POS 0.50MM R/A

4733
0522070460

0522070460

Woodhead - Molex

CONN FFC FPC TOP 4POS 1.00MM R/A

0
2005290060

2005290060

Woodhead - Molex

1.0 FPC ZIF BTM CONT EMBT PKG 6C

17578
0528521070

0528521070

Woodhead - Molex

CONN FFC BOTTOM 10POS 1.00MM R/A

6154
0528081171

0528081171

Woodhead - Molex

CONN FFC FPC VERT 11POS 1MM SMD

477
0527451997

0527451997

Woodhead - Molex

CONN FFC TOP 19POS 0.50MM R/A

201
0524372433

0524372433

Woodhead - Molex

CONN FFC BOTTOM 24POS 0.50MM R/A

2154
2004850435

2004850435

Woodhead - Molex

0.5 ONE-TOUCH RA 35P

6000
5051100892

5051100892

Woodhead - Molex

CONN FPC BOTTOM 8POS .5MM R/A

1153
0526101633

0526101633

Woodhead - Molex

CONN FPC VERT 16POS 1.00MM SMD

0

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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