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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0522712679

0522712679

Woodhead - Molex

CONN FPC BOTTOM 26POS 1.00MM R/A

2348
0527450633

0527450633

Woodhead - Molex

CONN FFC FPC TOP 6POS 0.50MM R/A

5262
0545481571

0545481571

Woodhead - Molex

CONN FFC BOTTOM 15POS 0.50MM R/A

0
0526102833

0526102833

Woodhead - Molex

CONN FPC VERT 28POS 1.00MM SMD

8366
0528520970

0528520970

Woodhead - Molex

CONN FFC BOTTOM 9POS 1.00MM R/A

5747
0527451397

0527451397

Woodhead - Molex

CONN FFC TOP 13POS 0.50MM R/A

926
0015474037

0015474037

Woodhead - Molex

CONN CIC FFC RCPT 3POS 2.54MM

2966
0527450797

0527450797

Woodhead - Molex

CONN FFC TOP 7POS 0.50MM R/A

5347
0528081671

0528081671

Woodhead - Molex

CONN FFC FPC VERT 16POS 1MM SMD

5563
0526100633

0526100633

Woodhead - Molex

CONN FPC VERT 6POS 1.00MM SMD

6741
0525591853

0525591853

Woodhead - Molex

CONN FFC VERT 18POS 0.50MM SMD

5549
5034801200

5034801200

Woodhead - Molex

CONN FFC FPC 12POS 0.50MM R/A

5520
0524352271

0524352271

Woodhead - Molex

CONN FFC TOP 22POS 0.50MM R/A

2174
0520440845

0520440845

Woodhead - Molex

CONN FFC FPC TOP 8POS 1.25MM R/A

295
0545501271

0545501271

Woodhead - Molex

CONN FFC TOP 12POS 0.50MM R/A

1566
0781272010

0781272010

Woodhead - Molex

CONN 0.5 FPC ZIF ST TP 20CKT

4712
0528923033

0528923033

Woodhead - Molex

CONN FFC BOTTOM 30POS 0.50MM R/A

10778
0526101133

0526101133

Woodhead - Molex

CONN FPC VERT 11POS 1.00MM SMD

4977
0541044631

0541044631

Woodhead - Molex

CONN FFC TOP 46POS 0.50MM R/A

187
5014610491

5014610491

Woodhead - Molex

CONN FPC BOTTOM 4POS 0.50MM R/A

13414

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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