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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
5027906091

5027906091

Woodhead - Molex

CONN FPC BOTTOM 60POS 0.50MM R/A

6700
0526101533

0526101533

Woodhead - Molex

CONN FPC VERT 15POS 1.00MM SMD

1484
0545482671

0545482671

Woodhead - Molex

CONN FFC BOTTOM 26POS 0.50MM R/A

1026
5051104591

5051104591

Woodhead - Molex

CONN FFC/FPC BOTTOM 45P .5MM R/A

7888
0039532305

0039532305

Woodhead - Molex

CONN FFC VERT 30POS 1.25MM PCB

1568
0528080471

0528080471

Woodhead - Molex

CONN FFC FPC VERT 4POS 1MM SMD

1619
0541323633

0541323633

Woodhead - Molex

CONN FFC BOTTOM 36POS 0.50MM R/A

7325
0522071833

0522071833

Woodhead - Molex

CONN FFC FPC TOP 18POS 1MM R/A

0
0512811094

0512811094

Woodhead - Molex

CONN FFC FPC 10POS 0.50MM R/A

25035
5035662700

5035662700

Woodhead - Molex

CONN FPC BOTTOM 27POS 0.30MM R/A

592
5016165185

5016165185

Woodhead - Molex

CONN FPC TOP 51POS 0.30MM R/A

1562
0512964094

0512964094

Woodhead - Molex

CONN FFC BOTTOM 40POS 0.50MM R/A

18890
5051103591

5051103591

Woodhead - Molex

CONN FFC/FPC BOTTOM 35P .5MM R/A

2728
5051101592

5051101592

Woodhead - Molex

CONN FPC BOTTOM 15POS .5MM R/A

216
0527932070

0527932070

Woodhead - Molex

CONN FPC TOP 20POS 1.00MM R/A

1635
5022313300

5022313300

Woodhead - Molex

CONN FFC VERT 33POS 0.50MM SMD

1192
0527451833

0527451833

Woodhead - Molex

CONN FFC TOP 18POS 0.50MM R/A

1152
0528081670

0528081670

Woodhead - Molex

CONN FPC VERT 16POS 1.00MM SMD

6196
0522070633

0522070633

Woodhead - Molex

CONN FFC FPC TOP 6POS 1.00MM R/A

2147483647
0522072260

0522072260

Woodhead - Molex

CONN FFC FPC TOP 22POS 1MM R/A

2600

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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