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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0522071633

0522071633

Woodhead - Molex

CONN FFC FPC TOP 16POS 1MM R/A

1030
5051102291

5051102291

Woodhead - Molex

CONN FFC/FPC BOTTOM 22P .5MM R/A

4261
0528060710

0528060710

Woodhead - Molex

CONN FPC VERT 7POS 1.00MM PCB

1210
0525591652

0525591652

Woodhead - Molex

CONN FPC/FFC 16POS .5MM VERT ZIF

8473
0527930870

0527930870

Woodhead - Molex

CONN FPC TOP 8POS 1.00MM R/A

10064
0527933070

0527933070

Woodhead - Molex

CONN FPC TOP 30POS 1.00MM R/A

443
0525592652

0525592652

Woodhead - Molex

CONN FFC VERT 26POS 0.50MM SMD

1185
0527451733

0527451733

Woodhead - Molex

CONN FFC TOP 17POS 0.50MM R/A

561
0541323262

0541323262

Woodhead - Molex

CONN FFC BOTTOM 32POS 0.50MM R/A

0
5034802600

5034802600

Woodhead - Molex

CONN FFC FPC 26POS 0.50MM R/A

0
5035665100

5035665100

Woodhead - Molex

CONN FPC BOTTOM 51POS 0.30MM R/A

18506
0541324062

0541324062

Woodhead - Molex

CONN FFC BOTTOM 40POS 0.50MM R/A

314714500
5017863091

5017863091

Woodhead - Molex

CONN FFC VERT 30POS 0.50MM SMD

2030
5052781433

5052781433

Woodhead - Molex

0.5 FFC ZIF BTM CONT EMBT PKG 14

1096
0527461271

0527461271

Woodhead - Molex

CONN FFC BOTTOM 12POS 0.50MM R/A

3550
0545481670

0545481670

Woodhead - Molex

CONN FFC BOTTOM 16POS 0.50MM R/A

19
5047543920

5047543920

Woodhead - Molex

CONN FPC 39POS .3MM SMD R/A

3778
0522070933

0522070933

Woodhead - Molex

CONN FFC FPC TOP 9POS 1.00MM R/A

2461
0541325033

0541325033

Woodhead - Molex

CONN FFC BOTTOM 50POS 0.50MM R/A

4489
0526100672

0526100672

Woodhead - Molex

CONN FPC VERT 6POS 1.00MM SMD

13022

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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