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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0545481171

0545481171

Woodhead - Molex

CONN FFC BOTTOM 11POS 0.50MM R/A

894
0015388048

0015388048

Woodhead - Molex

CONN CIC FFC RCPT 4POS 2.54MM

4201
0512812294

0512812294

Woodhead - Molex

CONN FFC FPC 22POS 0.50MM R/A

0
0545481033

0545481033

Woodhead - Molex

CONN FFC BOTTOM 10POS 0.5MM R/A

17480
0545500871

0545500871

Woodhead - Molex

CONN FFC FPC TOP 8POS 0.50MM R/A

14605
0528061210

0528061210

Woodhead - Molex

CONN FPC VERT 12POS 1.00MM PCB

0
0528081570

0528081570

Woodhead - Molex

CONN FPC VERT 15POS 1.00MM SMD

15212
0527461071

0527461071

Woodhead - Molex

CONN FFC BOTTOM 10POS 0.50MM R/A

3191
5022311500

5022311500

Woodhead - Molex

CONN FFC VERT 15POS 0.50MM SMD

4076
0525591633

0525591633

Woodhead - Molex

CONN FFC VERT 16POS 0.50MM SMD

6026
2005280060

2005280060

Woodhead - Molex

1.0 FPC ZIF BTM CONT EMBT PKG 6C

679
0527461671

0527461671

Woodhead - Molex

CONN FFC BOTTOM 16POS 0.50MM R/A

894112000
0527460671

0527460671

Woodhead - Molex

CONN FFC BOTTOM 6POS 0.50MM R/A

17096
0039532105

0039532105

Woodhead - Molex

CONN FFC VERT 10POS 1.25MM PCB

726
0545482271

0545482271

Woodhead - Molex

CONN FFC BOTTOM 22POS 0.50MM R/A

0
0520451445

0520451445

Woodhead - Molex

CONN FFC VERT 14POS 1.25MM PCB

7093
0527460971

0527460971

Woodhead - Molex

CONN FFC BOTTOM 9POS 0.50MM R/A

2678
0527451297

0527451297

Woodhead - Molex

CONN FFC TOP 12POS 0.50MM R/A

6399
0528081471

0528081471

Woodhead - Molex

CONN FFC FPC VERT 14POS 1MM SMD

2147483647
0039532244

0039532244

Woodhead - Molex

CONN FFC TOP 24POS 1.25MM R/A

1698

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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