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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0522712769

0522712769

Woodhead - Molex

CONN FPC BOTTOM 27POS 1.00MM R/A

219
0527461171

0527461171

Woodhead - Molex

CONN FFC BOTTOM 11POS 0.50MM R/A

533
0522070560

0522070560

Woodhead - Molex

CONN FFC FPC TOP 5POS 1.00MM R/A

11108
0522071060

0522071060

Woodhead - Molex

CONN FFC FPC TOP 10POS 1MM R/A

11476
0520300929

0520300929

Woodhead - Molex

CONN FPC VERT 9POS 1.00MM PCB

875
0039532265

0039532265

Woodhead - Molex

CONN FFC VERT 26POS 1.25MM PCB

0
0522710669

0522710669

Woodhead - Molex

CONN FPC BOTTOM 6POS 1.00MM R/A

10355
0528082471

0528082471

Woodhead - Molex

CONN FFC FPC VERT 24POS 1MM SMD

7452
0039532075

0039532075

Woodhead - Molex

CONN FFC VERT 7POS 1.25MM PCB

2927
0512811494

0512811494

Woodhead - Molex

CONN FFC FPC 14POS 0.50MM R/A

19354
0522071260

0522071260

Woodhead - Molex

CONN FFC FPC TOP 12POS 1MM R/A

1796
5051470490

5051470490

Woodhead - Molex

CONN FPC BOTTOM 4POS 2MM SMD R/A

1994
0524352471

0524352471

Woodhead - Molex

CONN FFC TOP 24POS 0.50MM R/A

1327
0528062710

0528062710

Woodhead - Molex

CONN FPC VERT 27POS 1.00MM PCB

155
0526102472

0526102472

Woodhead - Molex

CONN FPC VERT 24POS 1.00MM SMD

1450
0541043431

0541043431

Woodhead - Molex

CONN FFC TOP 34POS 0.50MM R/A

1995
0525590633

0525590633

Woodhead - Molex

CONN FFC VERT 6POS 0.50MM SMD

4019
5051100792

5051100792

Woodhead - Molex

CONN FPC BOTTOM 7POS .5MM R/A

0
0522711379

0522711379

Woodhead - Molex

CONN FPC BOTTOM 13POS 1.00MM R/A

3856
0522072460

0522072460

Woodhead - Molex

CONN FFC FPC TOP 24POS 1MM R/A

1571

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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