ample-chip ample-chip
RFQ
BOM

FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
5014610812

5014610812

Woodhead - Molex

CONN FPC BOTTOM 8POS 0.50MM R/A

726
5047405100

5047405100

Woodhead - Molex

CONN FPC 51POS .3MM SMD R/A

4374
0541045033

0541045033

Woodhead - Molex

CONN FFC TOP 50POS 0.50MM R/A

300
0528060810

0528060810

Woodhead - Molex

CONN FPC VERT 8POS 1.00MM PCB

4942
0545480833

0545480833

Woodhead - Molex

CONN FFC BOTTOM 8POS 0.5MM R/A

19472
0781191168

0781191168

Woodhead - Molex

CONN FFC VERT 16POS 0.50MM SMD

47
0522071433

0522071433

Woodhead - Molex

CONN FFC FPC TOP 14POS 1MM R/A

2034
0541044033

0541044033

Woodhead - Molex

CONN FFC TOP 40POS 0.50MM R/A

0
0541044533

0541044533

Woodhead - Molex

CONN FFC TOP 45POS 0.50MM R/A

1430
0526101433

0526101433

Woodhead - Molex

CONN FPC VERT 14POS 1.00MM SMD

701
5022503991

5022503991

Woodhead - Molex

CONN FPC 39POS 0.30MM R/A

2588
0528060410

0528060410

Woodhead - Molex

CONN FPC VERT 4POS 1.00MM PCB

12672
0528061410

0528061410

Woodhead - Molex

CONN FPC VERT 14POS 1.00MM PCB

0
0514411093

0514411093

Woodhead - Molex

CONN FFC BOTTOM 10POS 0.50MM R/A

372
0522072033

0522072033

Woodhead - Molex

CONN FFC FPC TOP 20POS 1MM R/A

133
0541043033

0541043033

Woodhead - Molex

CONN FFC TOP 30POS 0.50MM R/A

5654
0512812494

0512812494

Woodhead - Molex

CONN FFC FPC 24POS 0.50MM R/A

959136000
5034802400

5034802400

Woodhead - Molex

0.5 FPC BF H=1.0 ASSY 24P

10621
5020781360

5020781360

Woodhead - Molex

CONN FPC BOTTOM 13POS 0.25MM R/A

1146
0527451697

0527451697

Woodhead - Molex

CONN FFC TOP 16POS 0.50MM R/A

2185

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
RFQ BOM Call Skype Email
Top