D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
1727040129

1727040129

Woodhead - Molex

CONN D-SUB PIN PCB GOLD

316

1731120391

1731120391

Woodhead - Molex

CONN D-SUB SOCKET SLDR GOLD

500

1731120206

1731120206

Woodhead - Molex

CONN D-SUB PIN 26-28AWG CRIMP

298

1727040131

1727040131

Woodhead - Molex

CONN D-SUB SOCKET COAX CRIMP

152

1731120176

1731120176

Woodhead - Molex

CONN D-SUB SOCKET COAX GOLD

0

1731120193

1731120193

Woodhead - Molex

CONN D-SUB PIN PCB GOLD

0

1731120628

1731120628

Woodhead - Molex

FCT TERM HPWR RA PC PLG 20 AMP D

0

1731121121

1731121121

Woodhead - Molex

FCT TERM SIGN STAMPED RCPT CRP 2

0

1731120732

1731120732

Woodhead - Molex

RCPT FCT CRP 20-24AWG 30U

0

1731140038

1731140038

Woodhead - Molex

FCT TERM HFREQ SDR PLG 50 OHM NM

0

1731120996

1731120996

Woodhead - Molex

FCT TERM HPWR SDR RCPT 20AMP 12-

0

1731121744

1731121744

Woodhead - Molex

HAND TOOL FCT MCD

0

1731120624

1731120624

Woodhead - Molex

FCT TERM HPWR SDR PLG 20 AMP 12-

0

1731120186

1731120186

Woodhead - Molex

CONN D-SUB PIN COAX CRIMP GOLD

0

0830009560

0830009560

Woodhead - Molex

CONN D-SUB PIN 28AWG CRIMP GOLD

144532000

1731120319

1731120319

Woodhead - Molex

CONN D-SUB SOCKET 20-24AWG CRIMP

0

1731120901

1731120901

Woodhead - Molex

FCT TERM HPWR

0

1731120177

1731120177

Woodhead - Molex

CONN D-SUB SOCKET COAX GOLD

0

1731120171

1731120171

Woodhead - Molex

CONN D-SUB SOCKET COAX GOLD

0

1731120727

1731120727

Woodhead - Molex

RCPT FCT CRP 20-24AWG 50U

0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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