D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
1731120326

1731120326

Woodhead - Molex

FCT TERM HPWR CRP RCPT 20 AMP 12

0

1731120630

1731120630

Woodhead - Molex

COAX SOLDER POT CONTACT 50 OHM

0

1731120181

1731120181

Woodhead - Molex

CONN D-SUB SOCKET COAX CRIMP

0

1731121732

1731121732

Woodhead - Molex

HAND TOOL FCT MCD

2

1731120670

1731120670

Woodhead - Molex

HIGH CURRENT PCB ANGLED CONTACT

0

1731120331

1731120331

Woodhead - Molex

FCT TERM SIGN STAMPED RCPT CRP 2

0

1731120874

1731120874

Woodhead - Molex

FCT TERM HPWR

0

1731120678

1731120678

Woodhead - Molex

COAX CRIMP CONTACT 50 OHM

0

1731120192

1731120192

Woodhead - Molex

CONN D-SUB PIN PCB GOLD

0

1731120252

1731120252

Woodhead - Molex

FCT SCREW SET 4-40 UNC 9 ZINC PL

0

1731120893

1731120893

Woodhead - Molex

FCT TERM HPWR

0

1731121218

1731121218

Woodhead - Molex

FCT TERM HPWR

0

1731121093

1731121093

Woodhead - Molex

FCT TERM HPWR STR PC RCPT 20 AMP

0

1731120449

1731120449

Woodhead - Molex

FCT BLIND HFREQ CRP RCPT 50 OHM

0

1731120327

1731120327

Woodhead - Molex

FCT TERM HPWR CRP PLG 20 AMP 12-

0

1731120234

1731120234

Woodhead - Molex

FCT SCREW SET M3 8.6 ZINC PLATED

350

1731120821

1731120821

Woodhead - Molex

COAX PCB STAIGHT CONTACT 75 OHM

0

1731120744

1731120744

Woodhead - Molex

'FCT HD SIGN RCPT CRP 22-28AWG 8

0

1731120709

1731120709

Woodhead - Molex

CONN D-SUB PIN 26-28AWG 10K REEL

0

1731120198

1731120198

Woodhead - Molex

CONN D-SUB PIN PCB GOLD

0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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