D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
1731120908

1731120908

Woodhead - Molex

FCT TERM HPWR

0

1731120914

1731120914

Woodhead - Molex

HIGH CURRENT SOLDER POT CONTACT

0

1731120620

1731120620

Woodhead - Molex

FCT TERM HFREQ CRP PLG 75 OHM DI

0

1731120321

1731120321

Woodhead - Molex

FCT TERM HPWR PRESS PLG 40 AMP

0

1731121733

1731121733

Woodhead - Molex

HAND TOOL FCT MCD

2

1731120675

1731120675

Woodhead - Molex

FCT TERM HPWR CRP RCPT 30 AMP

0

1731121745

1731121745

Woodhead - Molex

HAND TOOL FCT MCD

0

1731120806

1731120806

Woodhead - Molex

FCT TERM HFREQ

0

1731120876

1731120876

Woodhead - Molex

FCT TERM HPWR

0

1731140032

1731140032

Woodhead - Molex

FCT TERM HFREQ SDR/CRP PLG 50 OH

0

1731120262

1731120262

Woodhead - Molex

FCT TERM SIGN STAMPED RCPT CRP 2

0

1731120777

1731120777

Woodhead - Molex

FCT TERM HFREQ

0

1731121081

1731121081

Woodhead - Molex

FCT TERM SIGN STAMPED RCPT CRP 2

0

1731120218

1731120218

Woodhead - Molex

CONN D-SUB SOCKET 18-22AWG CRIMP

20500

1731120485

1731120485

Woodhead - Molex

FCT SOCKETCONTACT 22 D

0

1731120676

1731120676

Woodhead - Molex

FCT TERM HPWR

0

0709841100

0709841100

Woodhead - Molex

CONN D-SUB PIN 28-36AWG SLDR

0

1731121200

1731121200

Woodhead - Molex

FCT TERM HPRC

0

1731120769

1731120769

Woodhead - Molex

FCT TERM HFREQ

0

1731120175

1731120175

Woodhead - Molex

CONN D-SUB SOCKET COAX GOLD

0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

RFQ BOM Call Skype Email
Top