D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
1731120347

1731120347

Woodhead - Molex

FCT TERM HPWR

0

1731120244

1731120244

Woodhead - Molex

FCT SCREW SET 4-40 UNC 10.7 ZINC

0

1731121083

1731121083

Woodhead - Molex

FCT TERM HPWR CRP PLG 30 AMP 10-

0

1731120679

1731120679

Woodhead - Molex

COAX SOLDER POT CONTACT 50 OHM

0

1731120021

1731120021

Woodhead - Molex

FCT TERM SIGN STAMPED RCPT CRP 2

9980

1731121104

1731121104

Woodhead - Molex

HIGH CURRENT PCB STRAIGHT CONTAC

0

1731120839

1731120839

Woodhead - Molex

FCT TERM HPWR

0

1731120935

1731120935

Woodhead - Molex

COAX SOLDER POT CONTACT 50 OHM

0

1731121746

1731121746

Woodhead - Molex

HAND TOOL FCT MCD

0

1731120384

1731120384

Woodhead - Molex

HIGH CURRENT CRIMP CONTACT (40A)

0

1731121084

1731121084

Woodhead - Molex

FCT TERM HPWR CRP RCPT 30 AMP 10

0

1731120740

1731120740

Woodhead - Molex

'FCT HD SIGN PLG CRP 22-28AWG 30

0

1731120141

1731120141

Woodhead - Molex

CONN D-SUB PIN HOSE/TUBING

0

0709841021

0709841021

Woodhead - Molex

CONN D-SUB PIN 28-36AWG PCB GOLD

0

1731120746

1731120746

Woodhead - Molex

RCPT FCT CRP 22-28AWG 30U

0

1731120647

1731120647

Woodhead - Molex

CONN D-SUB PIN CRIMP GOLD

0

1731120739

1731120739

Woodhead - Molex

'FCT HD SIGN PLG CRP 22-28AWG 8U

0

1731120618

1731120618

Woodhead - Molex

FCT TERM HFREQ CRP RCPT 50 OHM D

0

1731120187

1731120187

Woodhead - Molex

CONN D-SUB SOCKET COAX CRIMP

0

1731120623

1731120623

Woodhead - Molex

FCT TERM HFREQ CRP RCPT 75 OHM D

0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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