D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
1731120162

1731120162

Woodhead - Molex

CONN D-SUB SOCKET PCB GOLD

30

0709854006

0709854006

Woodhead - Molex

CONN D-SUB SOCKET 28-36AWG PCB

0

1731121046

1731121046

Woodhead - Molex

FCT TERM HFREQ

0

0051241022

0051241022

Woodhead - Molex

CONN D-SUB SOCKET 28-36AWG PCB

0

1731120747

1731120747

Woodhead - Molex

RCPT FCT CRP 22-28AWG 50U

0

1731120672

1731120672

Woodhead - Molex

FCT TERM HPWR

0

1731120719

1731120719

Woodhead - Molex

'FCT SIGN PLG CRP 20-24AWG 50U''

0

1731120332

1731120332

Woodhead - Molex

CONN D-SUB PIN 26-28AWG CRIMP

0

1731120271

1731120271

Woodhead - Molex

FCT TERM HPWR STR PC PLG 20 AMP

0

1731121114

1731121114

Woodhead - Molex

FCT TERM SIGN STAMPED RCPT CRP 2

0

1731120896

1731120896

Woodhead - Molex

FCT TERM HPWR

0

1731121145

1731121145

Woodhead - Molex

FCT TERM HFREQ

0

1731120662

1731120662

Woodhead - Molex

FCT TERM HFREQ RA PC PLG 50 OHM

0

1731120934

1731120934

Woodhead - Molex

COAX SOLDER POT CONTACT 50 OHM

0

1731120755

1731120755

Woodhead - Molex

FCT TERM HPWR CRP RCPT 30 AMP

0

1731121720

1731121720

Woodhead - Molex

FCT CONTACT STR PLG PCB

0

1731120303

1731120303

Woodhead - Molex

FCT TERM HPWR SDR PLG 40 AMP 8-1

0

1731120671

1731120671

Woodhead - Molex

HIGH CURRENT PCB ANGLED CONTACT

0

1731121731

1731121731

Woodhead - Molex

HAND TOOL FCT MCD

0

1731120728

1731120728

Woodhead - Molex

'FCT SIGN RCPT CRP 26-28AWG 50U'

0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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