| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Woodhead - Molex |
FCT BLIND HFREQ CRP PLG 50 OHM |
0 |
|
|
Woodhead - Molex |
FCT TERM HPWR STR PLG 20 AMP |
0 |
|
|
Woodhead - Molex |
CONN D-SUB PIN COAX GOLD |
0 |
|
|
Woodhead - Molex |
FCT TERM HPWR PRESS RCPT 30 AMP |
0 |
|
|
Woodhead - Molex |
CONN D-SUB PIN COAX GOLD |
0 |
|
|
Woodhead - Molex |
CONN D-SUB SOCKET COAX CRIMP |
0 |
|
|
Woodhead - Molex |
FCT TERM HPWR SDR RCPT 30 AMP 10 |
0 |
|
|
Woodhead - Molex |
FCT TERM HFREQ RA PC PLG 50 OHM |
0 |
|
|
Woodhead - Molex |
FCT TERM HPWR CRP RCPT 40 AMP 8- |
0 |
|
|
Woodhead - Molex |
CONN D-SUB SOCKET COAX GOLD |
0 |
|
|
Woodhead - Molex |
FCT TERM HFREQ CRP RCPT 75 OHM D |
0 |
|
|
Woodhead - Molex |
HAND TOOL FCT MCD |
0 |
|
|
Woodhead - Molex |
FCT TERM HPWR |
0 |
|
|
Woodhead - Molex |
FCT PINCONTACT 22 D |
0 |
|
|
Woodhead - Molex |
FCT TERM HFREQ RA PC RCPT 50 OHM |
0 |
|
|
Woodhead - Molex |
FCT TERM HPWR SDR RCPT 30 AMP 10 |
0 |
|
|
Woodhead - Molex |
CONN D-SUB PIN 16-18AWG CRIMP |
0 |
|
|
Woodhead - Molex |
CONN D-SUB PIN 18-22AWG CRIMP |
0 |
|
|
Woodhead - Molex |
RCPT FCT CRP 24-28AWG |
0 |
|
|
Woodhead - Molex |
FCT TOOL FL-SERIES |
0 |
|
D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.
| Type | Function Features | Application Examples |
|---|---|---|
| DE-9 | 9-pin configuration, compact size | RS-232 serial interfaces, PC COM ports |
| DB-25 | 25-pin configuration, parallel signal transmission | Older printer ports, industrial control systems |
| DC-37 | 37-pin high-density arrangement | Military equipment, test instrumentation |
| HD D-Sub | High-density double-row contacts | Video graphics (VGA), industrial automation |
Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.
| Parameter | Typical Range | Significance |
|---|---|---|
| Current Rating | 1-5 A per contact | Determines power handling capacity |
| Voltage Rating | 50-600 V AC/DC | Ensures dielectric strength |
| Contact Resistance | 10 m | Impacts signal integrity |
| Insulation Resistance | 1000 M | Prevents leakage currents |
| Operating Temperature | -55 C to +125 C | Environmental durability |
| Manufacturer | Representative Product |
|---|---|
| TE Connectivity | DEUTSCH D-Sub series with EMI filtering |
| Amphenol | High-density HD D-Sub 90-position connectors |
| Molex | Micro D-Sub for compact industrial applications |
| Samtec | High-speed D-Sub with 10 Gbps data rate |
Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.