D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
1731120215

1731120215

Woodhead - Molex

CONN D-SUB SOCKET 20-24AWG CRIMP

500

1731120790

1731120790

Woodhead - Molex

FCT TERM HFREQ

0

1731120387

1731120387

Woodhead - Molex

FCT TERM HPWR RA PC PLG 40 AMP D

0

1731120725

1731120725

Woodhead - Molex

'FCT SIGN RCPT CRP 20-24AWG 8U''

0

1731120858

1731120858

Woodhead - Molex

FCT TERM HPWR

0

1731120733

1731120733

Woodhead - Molex

RCPT FCT CRP 20-24AWG 30U

0

1731120722

1731120722

Woodhead - Molex

'FCT SIGN PLG CRP 26-28AWG 8U''

0

1731120698

1731120698

Woodhead - Molex

FCT TERM SIGN STAMPED RCPT CRP 2

0

1731120890

1731120890

Woodhead - Molex

FCT TERM HPWR

0

1731121215

1731121215

Woodhead - Molex

FCT TERM HPWR

0

1731120172

1731120172

Woodhead - Molex

CONN D-SUB PIN COAX GOLD

0

1731120664

1731120664

Woodhead - Molex

FCT TERM HFREQ

0

1731120410

1731120410

Woodhead - Molex

CONN D-SUB SOCKET 26-28AWG CRIMP

700

1731120180

1731120180

Woodhead - Molex

CONN D-SUB PIN COAX CRIMP GOLD

0

1731120323

1731120323

Woodhead - Molex

FCT TERM HPWR STR PC PLG 20A

0

0051241020

0051241020

Woodhead - Molex

CONN D-SUB SOCKET 28-36AWG PCB

0

1731120627

1731120627

Woodhead - Molex

FCT TERM HPWR SDR PLG 40 AMP 8-1

0

1731121103

1731121103

Woodhead - Molex

COAX PCB ANGLED CONTACT 75 OHM

0

1731120724

1731120724

Woodhead - Molex

PLUG FCT CRP 26-28AWG 50U

0

1731120317

1731120317

Woodhead - Molex

CONN D-SUB SOCKET 26-28AWG CRIMP

0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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