D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
1731120764

1731120764

Woodhead - Molex

FCT TERM HFREQ

0

1731120191

1731120191

Woodhead - Molex

CONN D-SUB SOCKET PCB GOLD

0

1731120444

1731120444

Woodhead - Molex

FCT BLIND HFREQ CRP RCPT 50 OHM

0

1731121235

1731121235

Woodhead - Molex

FCT TERM HPWR

0

1731120576

1731120576

Woodhead - Molex

COAX CRIMP CONTACT 75 OHM

100

1731120212

1731120212

Woodhead - Molex

CONN D-SUB SOCKET 18-22AWG CRIMP

0

1731121106

1731121106

Woodhead - Molex

FCT TERM HFREQ RA PC RCPT 50 OHM

0

1731120718

1731120718

Woodhead - Molex

'FCT SIGN PLG CRP 20-24AWG 30U''

0

1731120219

1731120219

Woodhead - Molex

CONN D-SUB SOCKET 18-22AWG CRIMP

0

1731120585

1731120585

Woodhead - Molex

FCT TERM SIGN STAMPED RCPT CRP 2

0

0830000083

0830000083

Woodhead - Molex

CONN D-SUB SOCKET 26-28AWG CRIMP

4308

1731120848

1731120848

Woodhead - Molex

FCT TERM HPWR

0

1731120445

1731120445

Woodhead - Molex

FCT BLIND HFREQ CRP PLG 50 OHM

0

1731120877

1731120877

Woodhead - Molex

FCT TERM HPWR

0

1731120833

1731120833

Woodhead - Molex

FCT TERM HPWR

0

1731120182

1731120182

Woodhead - Molex

CONN D-SUB PIN COAX CRIMP GOLD

0

1731120791

1731120791

Woodhead - Molex

FCT TERM HFREQ

0

1731121730

1731121730

Woodhead - Molex

HAND TOOL FCT MCD

1

1731121241

1731121241

Woodhead - Molex

FCT TERM HPWR

0

0830009503

0830009503

Woodhead - Molex

CONN D-SUB SOCKET 26-28AWG CRIMP

0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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