D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
1731121130

1731121130

Woodhead - Molex

FCT TERM HPWR STR PC RCPT 40 AMP

0

1731120044

1731120044

Woodhead - Molex

FCT TERM HPWR SDR PLG 10 AMP 16-

0

1731120184

1731120184

Woodhead - Molex

CONN D-SUB SOCKET COAX CRIMP

0

1731120645

1731120645

Woodhead - Molex

FCT TERM SIGN STAMPED PLG CRP 26

0

0579196902

0579196902

Woodhead - Molex

CONN D-SUB PIN 14AWG CRIMP TIN

0

0709841008

0709841008

Woodhead - Molex

CONN D-SUB PIN 28-36AWG SLDR

0

1731120752

1731120752

Woodhead - Molex

'FCT SIGN PLG CRP 20-24AWG 30U''

0

1731120873

1731120873

Woodhead - Molex

FCT TERM HPWR

0

1731120841

1731120841

Woodhead - Molex

FCT TERM HPWR

0

1731120270

1731120270

Woodhead - Molex

FCT TERM HPWR STR PC PLG 20 AMP

195

1731120913

1731120913

Woodhead - Molex

FCT TERM HPWR

0

1731120596

1731120596

Woodhead - Molex

HIGH CURRENT CRIMP CONTACT (40A)

0

1731120225

1731120225

Woodhead - Molex

CONN D-SUB PIN 24-28AWG CRIMP

0

1731120750

1731120750

Woodhead - Molex

RCPT FCT CRP 24-28AWG

0

1731120646

1731120646

Woodhead - Molex

FCT TERM SIGN STAMPED RCPT CRP 2

2200

1731120625

1731120625

Woodhead - Molex

FCT TERM HPWR SDR RCPT 20 AMP 12

0

1731121090

1731121090

Woodhead - Molex

FCT TERM SIGN STAMPED RCPT CRP 2

0

1731120840

1731120840

Woodhead - Molex

FCT TERM HPWR

0

1731120753

1731120753

Woodhead - Molex

'FCT SIGN PLG CRP 18-22AWG 8U''

0

1731120861

1731120861

Woodhead - Molex

FCT TERM HPWR

0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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