D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
1731121226

1731121226

Woodhead - Molex

FCT TERM HPWR

0

1731121244

1731121244

Woodhead - Molex

FCT TERM HPWR

0

1731120674

1731120674

Woodhead - Molex

FCT TERM HPWR

0

1731120715

1731120715

Woodhead - Molex

PLUG FCT CRP 20-24AWG 8U

0

1731120743

1731120743

Woodhead - Molex

RCPT FCT CRP 22-28AWG 8U

0

1731120567

1731120567

Woodhead - Molex

FCT PLASTIC LATCHING BLOCK

0

1731120716

1731120716

Woodhead - Molex

'FCT SIGN PLG CRP 20-24AWG 8U''

0

1731120831

1731120831

Woodhead - Molex

FCT TERM HPWR

0

1731121085

1731121085

Woodhead - Molex

FCT TERM HPWR SDR PLG 30 AMP 10-

0

1731120316

1731120316

Woodhead - Molex

FCT TERM SIGN STAMPED PLG CRP 26

0

1731120903

1731120903

Woodhead - Molex

FCT TERM HPWR

0

1731120891

1731120891

Woodhead - Molex

FCT TERM HPWR

0

1731120211

1731120211

Woodhead - Molex

CONN D-SUB SOCKET 18-22AWG CRIMP

0

1731120932

1731120932

Woodhead - Molex

COAX SOLDER POT CONTACT 75 OHM

0

1731120205

1731120205

Woodhead - Molex

CONN D-SUB PIN 18-22AWG CRIMP

0

1731120997

1731120997

Woodhead - Molex

FCT CRIMP TOOL

0

1731120851

1731120851

Woodhead - Molex

FCT TERM HPWR

0

1731120607

1731120607

Woodhead - Molex

HIGH CURRENT PCB STRAIGHT CONTAC

0

1731120816

1731120816

Woodhead - Molex

COAX PCB ANGLED CONTACT 75 OHM

0

1731120931

1731120931

Woodhead - Molex

COAX SOLDER POT CONTACT 75 OHM

0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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