D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
1731120038

1731120038

Woodhead - Molex

CONN D-SUB PIN 16-20AWG SLDR CUP

6300

1731120154

1731120154

Woodhead - Molex

CONN D-SUB PIN PCB GOLD

16

1731120156

1731120156

Woodhead - Molex

CONN D-SUB PIN PCB GOLD

0

1731120135

1731120135

Woodhead - Molex

CONN D-SUB PIN HOSE/TUBING

0

1727040151

1727040151

Woodhead - Molex

CONN D-SUB SOCKET 12-14AWG CRIMP

284

1731120644

1731120644

Woodhead - Molex

CONN D-SUB SOCKET 20-24AWG CRIMP

2250

1731120224

1731120224

Woodhead - Molex

CONN D-SUB PIN 24-28AWG CRIMP

0

1731120309

1731120309

Woodhead - Molex

CONN DSUB SCKT 12-16AWG SLDR CUP

193

1727040154

1727040154

Woodhead - Molex

CONN DSUB SCKT 16-20AWG SLDR CUP

0

1731120166

1731120166

Woodhead - Molex

CONN D-SUB PIN COAX GOLD

99

0504208000

0504208000

Woodhead - Molex

CONN D-SUB SOCKET 18-22AWG TIN

2147483647

1731120282

1731120282

Woodhead - Molex

HIGH CURRENT SOLDER POT CONTACT

200

1731120029

1731120029

Woodhead - Molex

CONN D-SUB SOCKET 16-20AWG CRIMP

191

1731120267

1731120267

Woodhead - Molex

FCT RUBBER BUSHING SIZE 3-4A

2003300

1727040150

1727040150

Woodhead - Molex

CONN D-SUB SOCKET 16-20AWG CRIMP

349

1731120033

1731120033

Woodhead - Molex

CONN D-SUB SOCKET 16-20AWG CRIMP

25

1727040130

1727040130

Woodhead - Molex

CONN D-SUB PIN COAX GOLD

216400

1727040189

1727040189

Woodhead - Molex

CONN D-SUB PIN PCB GOLD

41

1731120734

1731120734

Woodhead - Molex

'FCT SIGN RCPT CRP 26-28AWG 8U''

1000

1731120042

1731120042

Woodhead - Molex

CONN D-SUB PIN 8-12AWG SLDR CUP

0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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