D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
1731121200

1731121200

Woodhead - Molex

FCT TERM HPRC

0

170-102-170L003

170-102-170L003

NorComp

CONN D-SUB SOCKET 24-28AWG CRIMP

0

1731120769

1731120769

Woodhead - Molex

FCT TERM HFREQ

0

1731120175

1731120175

Woodhead - Molex

CONN D-SUB SOCKET COAX GOLD

0

09691845100

09691845100

HARTING

D SUB FE 50 OHMS PCB SOLDER CONT

0

1731120347

1731120347

Woodhead - Molex

FCT TERM HPWR

0

1731120244

1731120244

Woodhead - Molex

FCT SCREW SET 4-40 UNC 10.7 ZINC

0

1731121083

1731121083

Woodhead - Molex

FCT TERM HPWR CRP PLG 30 AMP 10-

0

L17HRD2F145G

L17HRD2F145G

Storage & Server IO (Amphenol ICC)

D SUB -REAR RELEASE CONTACTS

0

DN50-2628PC1

DN50-2628PC1

Hirose

CONN CRIMP PIN D-SUB 26-28AWG

0

09670006572

09670006572

HARTING

D SUB MA TURNED CONTACT AWG 26-2

0

030-9542-004

030-9542-004

VEAM

MICRO CENTI-LOC CONT

897

1731120679

1731120679

Woodhead - Molex

COAX SOLDER POT CONTACT 50 OHM

0

1731120021

1731120021

Woodhead - Molex

FCT TERM SIGN STAMPED RCPT CRP 2

9980

09670008248

09670008248

HARTING

CONN D-SUB SOCKET 20-24 AWG CRMP

0

132A13009X

132A13009X

CONEC

FEMALE R/A SOLDER PIN 15A

0

09670007246

09670007246

HARTING

DSUB-FE-CR-KON AWG24-28;AFS1;LR1

0

1418784

1418784

Phoenix Contact

CONN D-SUB PIN 26-28 AWG CRIMP

0

09692825232

09692825232

HARTING

D SUB MIXED MA CRIMP/CRIMP COAX

0

1731121104

1731121104

Woodhead - Molex

HIGH CURRENT PCB STRAIGHT CONTAC

0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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