D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
86564620067LF

86564620067LF

Storage & Server IO (Amphenol ICC)

CONN D-SUB PIN 20-24AWG CRIMP

0

86563003064LF

86563003064LF

Storage & Server IO (Amphenol ICC)

CONN D-SUB PIN 24-28AWG CRIMP

0

73550400103

73550400103

HARTING

MODULAR, F, 15, HI DENSITY DSUB

0

09692817234

09692817234

HARTING

D SUB MIXED MA SOLDER/CRIMP COAX

0

86564610067LF

86564610067LF

Storage & Server IO (Amphenol ICC)

CONN D-SUB PIN 24-28AWG CRIMP

0

09670007237

09670007237

HARTING

DSUB-FE-CR-KON AWG24-28;AFS3;RR1

0

09670374702

09670374702

HARTING

MIN D FE 37 P CRIMP TERMINAL_4-4

0

1-208778-2

1-208778-2

TE Connectivity Aerospace Defense and Marine

CONN D-SUB SOCKET S0LDER GOLD

0

1731121745

1731121745

Woodhead - Molex

HAND TOOL FCT MCD

0

L17HRD2F015K

L17HRD2F015K

Storage & Server IO (Amphenol ICC)

D SUB -REAR RELEASE CONTACTS

0

1731120806

1731120806

Woodhead - Molex

FCT TERM HFREQ

0

030-51454

030-51454

JAE Electronics

CONN CONTACT

0

403-30-15-119-459

403-30-15-119-459

DSUB M 20-24 MACH CRIMP G30

11064

L17RRD1F0410K

L17RRD1F0410K

Storage & Server IO (Amphenol ICC)

DSUB SCKT RR RELEASE CNTCT

0

1731120876

1731120876

Woodhead - Molex

FCT TERM HPWR

0

1731140032

1731140032

Woodhead - Molex

FCT TERM HFREQ SDR/CRP PLG 50 OH

0

C031-8996-101D

C031-8996-101D

C&K

031-8996-101-FR022

0

73550400108

73550400108

HARTING

DSUB CU (+) M 20-24 AWG TYPE T R

0

09670007266

09670007266

HARTING

DSUB FE-CR-KON- AWG24-28 AFS1;L5

0

L17HRD2F115K

L17HRD2F115K

Storage & Server IO (Amphenol ICC)

D SUB -REAR RELEASE CONTACTS

0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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