D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
1731120795

1731120795

Woodhead - Molex

FCT TERM HFREQ

0

09692822550

09692822550

HARTING

D-SUB HIGH VOLTAGE MALE CRIMP CO

0

330-5291-004

330-5291-004

VEAM

DSUB CON D*MA PIN CRP #20-26

2814

CD-SC-121

CD-SC-121

Hirose

D-SUB CONTACT FEMALE

0

1731121199

1731121199

Woodhead - Molex

FCT TERM HPRC

0

86566610067LF

86566610067LF

Storage & Server IO (Amphenol ICC)

CONN D-SUB SOCKET 24-28AWG CRIMP

0

D*C-20-22P-10000

D*C-20-22P-10000

JAE Electronics

CONN DSUB 22POS PIN

0

L17RRD2M1210G

L17RRD2M1210G

Storage & Server IO (Amphenol ICC)

DSUB PIN RR RELEASE CNTCT

0

1731120908

1731120908

Woodhead - Molex

FCT TERM HPWR

0

1731120914

1731120914

Woodhead - Molex

HIGH CURRENT SOLDER POT CONTACT

0

09560008477

09560008477

HARTING

D SUB HD FE TURNED CR-CONTPL3 A

0

1731120620

1731120620

Woodhead - Molex

FCT TERM HFREQ CRP PLG 75 OHM DI

0

L17HRD2F1110K

L17HRD2F1110K

Storage & Server IO (Amphenol ICC)

D SUB -REAR RELEASE CONTACTS

0

D130361-2

D130361-2

VEAM

DSUB SKT COAX R/A 50OHM G30

0

330-8674-013

330-8674-013

VEAM

APE CON PIN

1080

1731120321

1731120321

Woodhead - Molex

FCT TERM HPWR PRESS PLG 40 AMP

0

1731121733

1731121733

Woodhead - Molex

HAND TOOL FCT MCD

2

L17DM53740

L17DM53740

Storage & Server IO (Amphenol ICC)

COMBO D-CONTACTS

0

1731120675

1731120675

Woodhead - Molex

FCT TERM HPWR CRP RCPT 30 AMP

0

MDS-P-TS/PC

MDS-P-TS/PC

VEAM

CONN D-SUB PIN CRIMP PKG 100 MIN

92

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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