D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
SEMAFT09S

SEMAFT09S

Storage & Server IO (Amphenol ICC)

DM CRMP SOCKET CNR

0

D*C-20-24S-10000

D*C-20-24S-10000

JAE Electronics

CONN DSUB 24POS SOCKET

0

132A17029X

132A17029X

CONEC

CONTACT PIN FML SCREW ON

0

09670007148

09670007148

HARTING

DSUB-MA-CR-CON.AWG24-28;PL2;LR10

0

1731120839

1731120839

Woodhead - Molex

FCT TERM HPWR

0

DM130363-1

DM130363-1

VEAM

CONN D-SUB SOCKET COAX CABLE PCB

0

8656450067LF

8656450067LF

Storage & Server IO (Amphenol ICC)

CONN D-SUB PIN 20-28AWG CRIMP

0

09691815147

09691815147

HARTING

D SUB MIXED FE SOLDER/CRIMP 50 O

0

86564610065LF

86564610065LF

Storage & Server IO (Amphenol ICC)

CONN D-SUB PIN 24-28AWG CRIMP

0

FC422P2

FC422P2

PEI-Genesis

DSUB CON CRIMPSKT SZ 22 G15

0

J-SP2140(LF)(SN)

J-SP2140(LF)(SN)

JST

CONN D-SUB PIN 24-28AWG CRIMP

0

330-8933-012

330-8933-012

VEAM

CONTACT SIGNAL H2 P R/A 50

0

86566510064LF

86566510064LF

Storage & Server IO (Amphenol ICC)

CONN D-SUB SOCKET 24-28AWG CRIMP

18800

1731120935

1731120935

Woodhead - Molex

COAX SOLDER POT CONTACT 50 OHM

0

1731121746

1731121746

Woodhead - Molex

HAND TOOL FCT MCD

0

09670375602

09670375602

HARTING

MIN D MA 37 P CRIMP TERMINAL_4-4

0

DM53744-62

DM53744-62

VEAM

CONN D-SUB SOCKET 8AWG SLDR CUP

11

86382000LF

86382000LF

Storage & Server IO (Amphenol ICC)

CONN D-SUB PIN SLDR CUP GOLD

500

1731120384

1731120384

Woodhead - Molex

HIGH CURRENT CRIMP CONTACT (40A)

0

1731121084

1731121084

Woodhead - Molex

FCT TERM HPWR CRP RCPT 30 AMP 10

0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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