D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
1731120740

1731120740

Woodhead - Molex

'FCT HD SIGN PLG CRP 22-28AWG 30

0

1731120141

1731120141

Woodhead - Molex

CONN D-SUB PIN HOSE/TUBING

0

1418790

1418790

Phoenix Contact

CONN D-SUB SOCKET 22-28 AWG CRMP

0

031-1147-002

031-1147-002

VEAM

DSUB CON SKT D*MA 22D A156

6071

0709841021

0709841021

Woodhead - Molex

CONN D-SUB PIN 28-36AWG PCB GOLD

0

1731120746

1731120746

Woodhead - Molex

RCPT FCT CRP 22-28AWG 30U

0

1731120647

1731120647

Woodhead - Molex

CONN D-SUB PIN CRIMP GOLD

0

330-7707-010

330-7707-010

VEAM

D SUB

0

D130363-2

D130363-2

VEAM

DSUB CONT STRT SKT 50OHM G50

0

1731120739

1731120739

Woodhead - Molex

'FCT HD SIGN PLG CRP 22-28AWG 8U

0

86566710064LF

86566710064LF

Storage & Server IO (Amphenol ICC)

CONN D-SUB SOCKET 24-28AWG CRIMP

0

1731120618

1731120618

Woodhead - Molex

FCT TERM HFREQ CRP RCPT 50 OHM D

0

030-50661

030-50661

JAE Electronics

CONN CONTACT

0

L17DM537441C338

L17DM537441C338

Storage & Server IO (Amphenol ICC)

COMBO D-CONTACTS

0

L17DM537405005

L17DM537405005

Storage & Server IO (Amphenol ICC)

COMBO D-CONTACTS

0

L17HRD2M1410K

L17HRD2M1410K

Storage & Server IO (Amphenol ICC)

D SUB -REAR RELEASE CONTACTS

0

030-50770-21

030-50770-21

JAE Electronics

CONN CONTACT

0

L17DM5374020175

L17DM5374020175

Storage & Server IO (Amphenol ICC)

COMBO D-CONTACTS

0

1731120187

1731120187

Woodhead - Molex

CONN D-SUB SOCKET COAX CRIMP

0

330-8933-010

330-8933-010

VEAM

CONTACT SIGNAL H2 P R/A

0

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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