Backplane Connectors - Specialized

Part Number	Description / PDF	Quantity
0733581300 Woodhead - Molex	CONN MODULE VITA 67.2 8P PNL MNT	20
0459854463 Woodhead - Molex	CONN PLUG LPHPOWER 36POS PCB	0
0459854113 Woodhead - Molex	CONN PLUG LPHPOWER 16POS PCB	353
0760203010 Woodhead - Molex	CONN RCPT I-TRAC 140POS EDGE MNT	36
0755565000 Woodhead - Molex	CONN PLUG POWER 2POS PCB	20288
0761501020 Woodhead - Molex	CONN RCPT IMPACT 180POS EDGE MNT	351
0782141001 Woodhead - Molex	CONN RCPT 4POS PCB	2439
0761601038 Woodhead - Molex	CONN RCPT IMPACT 96POS EDGE MNT	313
0461130121 Woodhead - Molex	CONN RCPT LPHPOWER 12POS PCB	639
0761605010 Woodhead - Molex	CONN RCPT IMPACT 120POS EDGE MNT	1140
0459851462 Woodhead - Molex	CONN PLUG LPHPOWER 42POS PCB	78
0459858131 Woodhead - Molex	CONN PLUG LPHPOWER 28POS PCB	72
0768601036 Woodhead - Molex	CONN RCPT IMPACT 54POS EDGE MNT	462
0740591002 Woodhead - Molex	CONN HEADER VHDM 60POS PCB	0
0782111044 Woodhead - Molex	CONN HEADER POWER 4POS EDGE MNT	0
1724580412 Woodhead - Molex	CONN PLUG TEN60 16POS PCB	166
0783492001 Woodhead - Molex	CONN HEADER IMPACT 4POS EDGE MNT	524
0743002143 Woodhead - Molex	CONN RCPT HDM 72POS PCB	30
0761601010 Woodhead - Molex	CONN RCPT IMPACT 120POS EDGE MNT	121
1737080005 Woodhead - Molex	CONN RCPT 1POS PCB	71

Backplane Connectors - Specialized

1. Overview

Specialized backplane connectors are critical electromechanical components designed to establish reliable interconnections between printed circuit boards (PCBs) in complex electronic systems. These connectors enable high-speed data transmission, power distribution, and signal integrity in demanding environments. Their importance spans industries such as telecommunications, industrial automation, and aerospace, where system reliability and performance are paramount.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
High-Speed Backplane Connectors	Support data rates >25 Gbps with controlled impedance	Data center switches, 5G base stations
High-Power Backplane Connectors	Rated for >50A per contact with thermal management	Industrial motor drives, EV charging systems
High-Density Backplane Connectors	Miniaturized contacts with pitch <1.0mm	Medical imaging equipment, test instrumentation
Hermetic Backplane Connectors	IP68-rated sealing for extreme environments	Subsea sensors, military avionics

3. Structure and Components

Typical construction includes: - Contact Pins: Phosphor bronze or beryllium copper with gold plating - Insulation Housing: LCP (Liquid Crystal Polymer) or PPS (Polyphenylene Sulfide) - Shielding: 360 EMI protection with stainless steel springs - Retention Mechanism: Polarized keying and threaded inserts - Thermal Management: Integrated heat dissipation fins

4. Key Technical Specifications

Parameter	Typical Range	Importance
Current Rating	1-100A	Power transmission capability
Contact Resistance	0.5-5m	Signal integrity maintenance
Dielectric Withstanding Voltage	500V-5kV	Electrical safety assurance
Operating Temperature	-55 C to +125 C	Environmental reliability
Mating Cycles	500-20,000	Long-term durability

5. Application Fields

Telecommunications: 5G NR base stations, optical transport networks
Industrial: Programmable logic controllers (PLCs), robotics
Medical: MRI scanners, digital radiography systems
Transportation: Railway signaling systems, EV powertrains

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Feature
TE Connectivity	Hypertac Backplane	100Gbps data rate with floating contact design
Amphenol	Rosenberger 400Gbps	Modular architecture for scalable networks
Molex	Impel High-Speed	Differential pair shielding for signal integrity

7. Selection Guidelines

Evaluate system bandwidth requirements (e.g., PCIe 5.0 needs 32 GT/s)
Verify vibration/thermal cycling compliance (e.g., Telcordia GR-63-CORE)
Assess PCB footprint compatibility (e.g., orthogonal vs. parallel mounting)
Confirm RoHS/REACH compliance for regulatory requirements
Balance cost vs. expected product lifecycle (5-15 years typical)

8. Industry Trends

Key developments include: - Transition to 112 Gbps PAM4 signaling for next-gen data centers - Integration of optical interfaces in hybrid electro-optical connectors - Adoption of advanced plating materials (e.g., nano-coated gold alloys) - Growing demand for circular (360 ) interconnect solutions - Implementation of AI-driven predictive maintenance features in connectors