Backplane Connectors - Specialized

Part Number	Description / PDF	Quantity
0761703420 Woodhead - Molex	CONN RCPT IMPACT 90POS EDGE MNT	0
0740581002 Woodhead - Molex	CONN HEADER VHDM 60POS PCB	0
0459844342 Woodhead - Molex	CONN RCPT LPHPOWER 28POS PCB	168
0740591001 Woodhead - Molex	CONN HEADER VHDM 60POS PCB	109
0761701020 Woodhead - Molex	CONN RCPT IMPACT 90POS EDGE MNT	1673
0733581280 Woodhead - Molex	CONN MODULE VITA 67.1 4P PNL MNT	25
0459854231 Woodhead - Molex	CONN PLUG LPHPOWER 24POS PCB	291
0761705036 Woodhead - Molex	CONN RCPT IMPACT 54POS EDGE MNT	0
0764951127 Woodhead - Molex	CONN HDR IMPACT 120POS EDGE MNT	0
0459854142 Woodhead - Molex	CONN PLUG LPHPOWER 28POS PCB	128
1713201022 Woodhead - Molex	CONN RCPT IMPEL 96POS PCB	99
1713351807 Woodhead - Molex	CONN HEADER IMPEL PCB	499
0464373001 Woodhead - Molex	CONN PLUG TEN60 28POS PCB	0
0740611004 Woodhead - Molex	CONN HEADER VHDM 80POS PCB	0
0740602502 Woodhead - Molex	CONN HEADER VHDM 200POS PCB	0
0459851423 Woodhead - Molex	CONN PLUG LPHPOWER 26POS PCB	35
1722010002 Woodhead - Molex	CONN RCPT POWER PCB	99
0767639001 Woodhead - Molex	CONN HEADER VHDM 60POS PCB	281
1715107136 Woodhead - Molex	CONN RCPT IMPEL 36POS PCB	0
0761601020 Woodhead - Molex	CONN RCPT IMPACT 120POS EDGE MNT	216

Backplane Connectors - Specialized

1. Overview

Specialized backplane connectors are critical electromechanical components designed to establish reliable interconnections between printed circuit boards (PCBs) in complex electronic systems. These connectors enable high-speed data transmission, power distribution, and signal integrity in demanding environments. Their importance spans industries such as telecommunications, industrial automation, and aerospace, where system reliability and performance are paramount.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
High-Speed Backplane Connectors	Support data rates >25 Gbps with controlled impedance	Data center switches, 5G base stations
High-Power Backplane Connectors	Rated for >50A per contact with thermal management	Industrial motor drives, EV charging systems
High-Density Backplane Connectors	Miniaturized contacts with pitch <1.0mm	Medical imaging equipment, test instrumentation
Hermetic Backplane Connectors	IP68-rated sealing for extreme environments	Subsea sensors, military avionics

3. Structure and Components

Typical construction includes: - Contact Pins: Phosphor bronze or beryllium copper with gold plating - Insulation Housing: LCP (Liquid Crystal Polymer) or PPS (Polyphenylene Sulfide) - Shielding: 360 EMI protection with stainless steel springs - Retention Mechanism: Polarized keying and threaded inserts - Thermal Management: Integrated heat dissipation fins

4. Key Technical Specifications

Parameter	Typical Range	Importance
Current Rating	1-100A	Power transmission capability
Contact Resistance	0.5-5m	Signal integrity maintenance
Dielectric Withstanding Voltage	500V-5kV	Electrical safety assurance
Operating Temperature	-55 C to +125 C	Environmental reliability
Mating Cycles	500-20,000	Long-term durability

5. Application Fields

Telecommunications: 5G NR base stations, optical transport networks
Industrial: Programmable logic controllers (PLCs), robotics
Medical: MRI scanners, digital radiography systems
Transportation: Railway signaling systems, EV powertrains

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Feature
TE Connectivity	Hypertac Backplane	100Gbps data rate with floating contact design
Amphenol	Rosenberger 400Gbps	Modular architecture for scalable networks
Molex	Impel High-Speed	Differential pair shielding for signal integrity

7. Selection Guidelines

Evaluate system bandwidth requirements (e.g., PCIe 5.0 needs 32 GT/s)
Verify vibration/thermal cycling compliance (e.g., Telcordia GR-63-CORE)
Assess PCB footprint compatibility (e.g., orthogonal vs. parallel mounting)
Confirm RoHS/REACH compliance for regulatory requirements
Balance cost vs. expected product lifecycle (5-15 years typical)

8. Industry Trends

Key developments include: - Transition to 112 Gbps PAM4 signaling for next-gen data centers - Integration of optical interfaces in hybrid electro-optical connectors - Adoption of advanced plating materials (e.g., nano-coated gold alloys) - Growing demand for circular (360 ) interconnect solutions - Implementation of AI-driven predictive maintenance features in connectors