Backplane Connectors - Specialized

Part Number	Description / PDF	Quantity
0761349001 Woodhead - Molex	CONN HEADER VHDM 80POS PCB	50232
0740571004 Woodhead - Molex	CONN HEADER VHDM 60POS PCB	0
1713951807 Woodhead - Molex	CONN HEADER IMPEL PCB	0
0761651328 Woodhead - Molex	CONN HEADER IMPACT 54POS PCB	876
0782171011 Woodhead - Molex	CONN HEADER POWER 6POS EDGE MNT	222
0761705006 Woodhead - Molex	CONN RCPT IMPACT 54POS EDGE MNT	0
0782471001 Woodhead - Molex	CONN RCPT IMPACT 4POS EDGE MNT	994
0740621001 Woodhead - Molex	CONN HEADER VHDM 80POS PCB	157
0459858432 Woodhead - Molex	CONN PLUG LPHPOWER 28POS PCB	0
0757103010 Woodhead - Molex	CONN RCPT I-TRAC 220POS EDGE MNT	22
0782271001 Woodhead - Molex	CONN RCPT POWER 2POS PCB	439
0761705038 Woodhead - Molex	CONN RCPT IMPACT 72POS EDGE MNT	1727
0460811000 Woodhead - Molex	CONN HEADER POWER 4POS PCB	352
0761651108 Woodhead - Molex	CONN HEADER IMPACT 90POS PCB	712
1713203038 Woodhead - Molex	CONN RCPT IMPEL 64POS PCB	0
0783491004 Woodhead - Molex	CONN HEADER IMPACT 4POS EDGE MNT	545
0459854412 Woodhead - Molex	CONN PLUG LPHPOWER 16POS PCB	0
0459854452 Woodhead - Molex	CONN PLUG LPHPOWER 32POS PCB	0
0461120403 Woodhead - Molex	CONN RCPT LPHPOWER 4POS PCB	185
0461120201 Woodhead - Molex	CONN RCPT LPHPOWER 2POS PCB	895

Backplane Connectors - Specialized

1. Overview

Specialized backplane connectors are critical electromechanical components designed to establish reliable interconnections between printed circuit boards (PCBs) in complex electronic systems. These connectors enable high-speed data transmission, power distribution, and signal integrity in demanding environments. Their importance spans industries such as telecommunications, industrial automation, and aerospace, where system reliability and performance are paramount.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
High-Speed Backplane Connectors	Support data rates >25 Gbps with controlled impedance	Data center switches, 5G base stations
High-Power Backplane Connectors	Rated for >50A per contact with thermal management	Industrial motor drives, EV charging systems
High-Density Backplane Connectors	Miniaturized contacts with pitch <1.0mm	Medical imaging equipment, test instrumentation
Hermetic Backplane Connectors	IP68-rated sealing for extreme environments	Subsea sensors, military avionics

3. Structure and Components

Typical construction includes: - Contact Pins: Phosphor bronze or beryllium copper with gold plating - Insulation Housing: LCP (Liquid Crystal Polymer) or PPS (Polyphenylene Sulfide) - Shielding: 360 EMI protection with stainless steel springs - Retention Mechanism: Polarized keying and threaded inserts - Thermal Management: Integrated heat dissipation fins

4. Key Technical Specifications

Parameter	Typical Range	Importance
Current Rating	1-100A	Power transmission capability
Contact Resistance	0.5-5m	Signal integrity maintenance
Dielectric Withstanding Voltage	500V-5kV	Electrical safety assurance
Operating Temperature	-55 C to +125 C	Environmental reliability
Mating Cycles	500-20,000	Long-term durability

5. Application Fields

Telecommunications: 5G NR base stations, optical transport networks
Industrial: Programmable logic controllers (PLCs), robotics
Medical: MRI scanners, digital radiography systems
Transportation: Railway signaling systems, EV powertrains

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Feature
TE Connectivity	Hypertac Backplane	100Gbps data rate with floating contact design
Amphenol	Rosenberger 400Gbps	Modular architecture for scalable networks
Molex	Impel High-Speed	Differential pair shielding for signal integrity

7. Selection Guidelines

Evaluate system bandwidth requirements (e.g., PCIe 5.0 needs 32 GT/s)
Verify vibration/thermal cycling compliance (e.g., Telcordia GR-63-CORE)
Assess PCB footprint compatibility (e.g., orthogonal vs. parallel mounting)
Confirm RoHS/REACH compliance for regulatory requirements
Balance cost vs. expected product lifecycle (5-15 years typical)

8. Industry Trends

Key developments include: - Transition to 112 Gbps PAM4 signaling for next-gen data centers - Integration of optical interfaces in hybrid electro-optical connectors - Adoption of advanced plating materials (e.g., nano-coated gold alloys) - Growing demand for circular (360 ) interconnect solutions - Implementation of AI-driven predictive maintenance features in connectors