Backplane Connectors - Specialized

Part Number	Description / PDF	Quantity
0782131044 Woodhead - Molex	CONN HEADER POWER 4POS EDGE MNT	329
0755425000 Woodhead - Molex	CONN RCPT POWER 1POS PCB	0
0461148200 Woodhead - Molex	CONN RCPT LPHPOWER 28POS PCB	0
0761703010 Woodhead - Molex	CONN RCPT IMPACT 90POS EDGE MNT	0
0783472001 Woodhead - Molex	CONN HEADER IMPACT 4POS EDGE MNT	294
0760201004 Woodhead - Molex	CONN RCPT I-TRAC 56POS EDGE MNT	88
0459844483 Woodhead - Molex	CONN RCPT LPHPOWER 44POS PCB	70
1703401020 Woodhead - Molex	CONN RCPT IMPACT 120POS EDGE MNT	1863
0736441016 Woodhead - Molex	CONN HEADER HDM 144POS PCB	216
0461120801 Woodhead - Molex	CONN RCPT LPHPOWER 8POS PCB	450
0464363003 Woodhead - Molex	CONN RCPT TEN60 28POS PCB	0
0764101607 Woodhead - Molex	CONN HDR IMPACT 144POS EDGE MNT	764
0757105006 Woodhead - Molex	CONN RCPT I-TRAC 132POS EDGE MNT	211
0459844422 Woodhead - Molex	CONN RCPT LPHPOWER 20POS PCB	738
0459844123 Woodhead - Molex	CONN RCPT LPHPOWER 20POS PCB	884
0740592501 Woodhead - Molex	CONN HEADER VHDM 150POS PCB	36
0760601026 Woodhead - Molex	CONN RCPT IMPACT 240POS PNL MNT	0
0764551627 Woodhead - Molex	CONN HEADER IMPACT 96POS PCB	36
1721850009 Woodhead - Molex	CONN PLUG POWER 6POS PCB	0
0764501107 Woodhead - Molex	CONN HDR IMPACT 60POS EDGE MNT	0

Backplane Connectors - Specialized

1. Overview

Specialized backplane connectors are critical electromechanical components designed to establish reliable interconnections between printed circuit boards (PCBs) in complex electronic systems. These connectors enable high-speed data transmission, power distribution, and signal integrity in demanding environments. Their importance spans industries such as telecommunications, industrial automation, and aerospace, where system reliability and performance are paramount.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
High-Speed Backplane Connectors	Support data rates >25 Gbps with controlled impedance	Data center switches, 5G base stations
High-Power Backplane Connectors	Rated for >50A per contact with thermal management	Industrial motor drives, EV charging systems
High-Density Backplane Connectors	Miniaturized contacts with pitch <1.0mm	Medical imaging equipment, test instrumentation
Hermetic Backplane Connectors	IP68-rated sealing for extreme environments	Subsea sensors, military avionics

3. Structure and Components

Typical construction includes: - Contact Pins: Phosphor bronze or beryllium copper with gold plating - Insulation Housing: LCP (Liquid Crystal Polymer) or PPS (Polyphenylene Sulfide) - Shielding: 360 EMI protection with stainless steel springs - Retention Mechanism: Polarized keying and threaded inserts - Thermal Management: Integrated heat dissipation fins

4. Key Technical Specifications

Parameter	Typical Range	Importance
Current Rating	1-100A	Power transmission capability
Contact Resistance	0.5-5m	Signal integrity maintenance
Dielectric Withstanding Voltage	500V-5kV	Electrical safety assurance
Operating Temperature	-55 C to +125 C	Environmental reliability
Mating Cycles	500-20,000	Long-term durability

5. Application Fields

Telecommunications: 5G NR base stations, optical transport networks
Industrial: Programmable logic controllers (PLCs), robotics
Medical: MRI scanners, digital radiography systems
Transportation: Railway signaling systems, EV powertrains

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Feature
TE Connectivity	Hypertac Backplane	100Gbps data rate with floating contact design
Amphenol	Rosenberger 400Gbps	Modular architecture for scalable networks
Molex	Impel High-Speed	Differential pair shielding for signal integrity

7. Selection Guidelines

Evaluate system bandwidth requirements (e.g., PCIe 5.0 needs 32 GT/s)
Verify vibration/thermal cycling compliance (e.g., Telcordia GR-63-CORE)
Assess PCB footprint compatibility (e.g., orthogonal vs. parallel mounting)
Confirm RoHS/REACH compliance for regulatory requirements
Balance cost vs. expected product lifecycle (5-15 years typical)

8. Industry Trends

Key developments include: - Transition to 112 Gbps PAM4 signaling for next-gen data centers - Integration of optical interfaces in hybrid electro-optical connectors - Adoption of advanced plating materials (e.g., nano-coated gold alloys) - Growing demand for circular (360 ) interconnect solutions - Implementation of AI-driven predictive maintenance features in connectors