TVS - Mixed Technology

Part Number	Description / PDF	Quantity
VK105MK151R060P050 KEMET	VARISTOR 100V 150A RADIAL	0
2906320 Phoenix Contact	VAL-MS+TE-AR 350 VF/P-FM	5
ESDU02A12VR25V Stackpole Electronics, Inc.	VARISTOR 25V 0402	0
SP723ABG Wickmann / Littelfuse	TVS ARRAY ESD 6 INPUT 30V 8-SOIC	11977840
SN65240PWG4 Texas Instruments	IC USB TRANSIENT SUPP 8-TSSOP	0
2905230 Phoenix Contact	PLT-SEC-T3-3S-230-FM	3
V2F118A400Y2EDP Elco (AVX)	VARISTOR CAP FEEDTHRU 18V 0805	10517
B3104UALRP Wickmann / Littelfuse	BATTRAX SLIC DUAL NEG 50A MS013	0
ESDU02A3V3R25V Stackpole Electronics, Inc.	VARISTOR 25V 0402	0
2800054 Phoenix Contact	S-PT-EX-48DC-1/2"	0
82357120220 Würth Elektronik Midcom	ESD SUPPRESSOR TVS 55V 0402	10000
VK105MM151R006P050 KEMET	VARISTOR 11V 150A RADIAL	0
P1101UCLTP Wickmann / Littelfuse	SIDACTOR SLIC 4CHP 500A MS013	0
GMOV-14D251K J.W. Miller / Bourns	GMOV 14MM, 250VRMS	0
SN65240P Texas Instruments	IC DUAL USB PORT TVS 8-DIP	500
P0901CA2LRP Wickmann / Littelfuse	SIDACTOR UNI 75V 50A DO214	0
ADG465BRM Analog Devices, Inc.	SINGLE CHANNEL PROTECTOR	840
GMOV-14D301K J.W. Miller / Bourns	GMOV 14MM, 300VRMS	259
B1201UCLRP Wickmann / Littelfuse	BATTRAX SLIC DUAL NEG 500A MS013	0
2819008 Phoenix Contact	SURGE PROTECTION PLUG 24V	1

TVS - Mixed Technology

1. Overview

Mixed Technology TVS devices combine multiple semiconductor materials and protection mechanisms to achieve superior transient voltage suppression performance. These hybrid solutions integrate silicon-based avalanche diodes, polymer-based ESD protection, and advanced packaging technologies to address complex electromagnetic interference (EMI) challenges in modern electronics. Their importance grows with the increasing demand for reliable protection in high-speed data lines, power systems, and sensitive ICs across industrial, automotive, and consumer applications.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Silicon-Polymer Hybrid TVS	Combines fast silicon diode response with polymer self-recovery capability	USB 3.2 interfaces, HDMI ports
Multi-Layer Varistor-TVS	Stacked silicon layers for multi-stage voltage clamping	Industrial power supplies, 5G base stations
Glass-Passivated Hybrid TVS	Hermetic glass encapsulation with integrated RC filtering	Automotive sensors, medical devices

3. Structure and Composition

Typical mixed technology TVS devices feature a 3D heterogeneous integration structure:

Active layer: Silicon carbide (SiC) or gallium nitride (GaN) semiconductor matrix
Passivation layer: Borosilicate glass or polymer composite
Electrode system: Multi-fingered aluminum-copper hybrid metallization
Thermal management: Embedded graphite heat spreader
Package: Lead-free QFN or DFN with EMI shielding coating

4. Key Technical Parameters

Parameter	Importance
Breakdown Voltage (Vbr)	Determines protection threshold for normal operation
Clamping Voltage (Vc)	Defines maximum voltage transmitted to protected circuit
Response Time (tr)	Measures speed of transition from blocking to conducting state
Power Dissipation (Pppm)	Indicates energy absorption capability during transients
Capacitance (Cj)	Critical for high-speed signal integrity preservation
Operating Temperature	Defines environmental reliability range (-55 C to +150 C typical)

5. Application Fields

Major industries utilizing mixed technology TVS devices include:

Telecommunications: 5G NR base stations, optical transceivers
Industrial Automation: PLC systems, motor drives
Automotive Electronics: CAN-FD interfaces, LiDAR systems
Consumer Devices: Smartphone charging ports, AR/VR headsets

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Littelfuse	SMxxxHCA Series	40kV ESD protection, 0.5pF capacitance, 0.1ns response
STMicroelectronics	TVSH Series	Automotive qualified, AEC-Q101 certified, 300W peak power
Bourns	PGB1 Series	Multi-layer ceramic-silicon hybrid, 10Gbps data rate support

7. Selection Guidelines

Key considerations when selecting mixed technology TVS components:

Match breakdown voltage to system operating voltage (typically 10-15% margin)
Verify clamping voltage compatibility with protected IC's maximum ratings
Consider parasitic capacitance for high-speed (>1Gbps) applications
Evaluate thermal derating curves for intended operating environment
Check compliance with industry standards (IEC 61000-4-2, ISO 10605)
Assess packaging requirements (SMD vs through-hole, board space constraints)

8. Industry Trends

Emerging developments in mixed technology TVS field include:

Integration of AI-based predictive protection algorithms
Development of 3D-printed nanocomposite TVS structures
Adoption of wafer-level packaging for 0.1pF capacitance levels
Implementation of energy recovery features in hybrid architectures
Advancements in terahertz transient suppression materials