Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
2153232033

2153232033

Woodhead - Molex

MINIFIT JR SR M-S 3 CIRCUIT 600M

71

0451350210

0451350210

Woodhead - Molex

MINIFIT 2 CIRCUIT 1M CABLE ASSEM

283

2153262063

2153262063

Woodhead - Molex

MINIFIT JR DR R-S 6 CIRCUIT 600M

0

0923161008

0923161008

Woodhead - Molex

10CC PICOFLEX 80MM LONG

0

2147571063

2147571063

Woodhead - Molex

MICRO-FIT3.0 P-P 6 CIRCUIT 600MM

1142

2153252021

2153252021

Woodhead - Molex

MINIFIT JR DR R-R 2 CIRCUIT 150M

0

2174661053

2174661053

Woodhead - Molex

ULTRA-FIT SR R-S 5CKT 600MM DISC

0

0451110601

0451110601

Woodhead - Molex

MICROLOCK PLUS CABLE BLACK 6 CKT

11751500

2162821032

2162821032

Woodhead - Molex

MX150 P-P SR 3CKT 300MM SN SEALE

0

0151360401

0151360401

Woodhead - Molex

MICROCLASP 4 CIRCUIT 100MM

0

0151350302

0151350302

Woodhead - Molex

CLICKMATE 3 CIRCUIT 150MM

0

0151350406

0151350406

Woodhead - Molex

CLICKMATE 4 CIRCUIT 600MM

2086

2147511101

2147511101

Woodhead - Molex

MICROFIT 3.0 SR R-S 10CKT 150 MM

275

0151320401

0151320401

Woodhead - Molex

CABLE ASSY PICOLOCK 4 POS 100MM

1463

2147581061

2147581061

Woodhead - Molex

MICRO-FIT3.0 P-S 6 CIRCUIT 150MM

0

2151700803

2151700803

Woodhead - Molex

CABLE ASSY. 8 CKT PICO-CLASP 600

0

1502070003

1502070003

Woodhead - Molex

DITTO SG/END HARNESS 4 CKT .30M

1012

0511100850-10-A-6-Z

0511100850-10-A-6-Z

Woodhead - Molex

8 CIRC CABLE ASSY 10" Z

54

2174661083

2174661083

Woodhead - Molex

ULTRA-FIT SR R-S 8CKT 600MM DISC

0

1451320703

1451320703

Woodhead - Molex

MICRO-FIT TPA-TO-MICRO-FIT TPA O

91

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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