Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
2451320210

2451320210

Woodhead - Molex

MICROFIT 2 CIRCUIT BLACK 1M OVER

620

0151350202

0151350202

Woodhead - Molex

CLICKMATE 2 CIRCUIT 150MM

0

2153221023

2153221023

Woodhead - Molex

MINIFIT JR SR M-M 2 CIRCUIT 600M

500

0151321203

0151321203

Woodhead - Molex

CABLE ASSY PICOLOCK 12 POS 300MM

1637

2451300805

2451300805

Woodhead - Molex

8 CIRCUIT 500MM NANOFIT OVERMOLD

387

2162831032

2162831032

Woodhead - Molex

MX150 P-S SR 3CKT 300MM SN SEALE

0

0151340601

0151340601

Woodhead - Molex

PICOBLADE 6 CIRCUIT 100MM

0

0923151625

0923151625

Woodhead - Molex

16CC PICOFLEX 250MM LONG

1089

0369210403

0369210403

Woodhead - Molex

L1NK 396 4 CIRCUIT 300MM

64

2162711021

2162711021

Woodhead - Molex

SL POSITIVE LOCK R-S 2CKT 100MM

0

2153222023

2153222023

Woodhead - Molex

MINIFIT JR SR M-M 2 CIRCUIT 600M

500

2147571083

2147571083

Woodhead - Molex

MICRO-FIT3.0 P-P 8 CIRCUIT 600MM

838

2451301010

2451301010

Woodhead - Molex

10 CIRCUIT 1M NANOFIT OVERMOLDED

123

2164011033

2164011033

Woodhead - Molex

MEGAFIT SR R-S 3 CKT 600 MM CABL

0

2147512051

2147512051

Woodhead - Molex

MICROFIT 3.0 SR R-S 5CKT 150 MM

440

2162911062

2162911062

Woodhead - Molex

STANDARD .093 6 CIRCUIT R TO S 3

0

2153232021

2153232021

Woodhead - Molex

MINIFIT JR SR M-S 2 CIRCUIT 150M

500

2164001023

2164001023

Woodhead - Molex

MEGAFIT SR R-R 2 CKT 600 MM CABL

0

0151310402

0151310402

Woodhead - Molex

CABLE-ASSY PICOLOCK 4 CIRCUIT 15

335

0151321005

0151321005

Woodhead - Molex

CABLE ASSY PICOLOCK 10 POS 450MM

1895

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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