Rectangular Cable Assemblies

Part Number	Description / PDF	Quantity
2162921021 Woodhead - Molex	STANDARD .093 2 CIRCUIT P TO P 1	0
2153282102 Woodhead - Molex	MINIFIT JR DR P-S 10 CIRCUIT 300	0
2153271043 Woodhead - Molex	MINIFIT JR DR P-P 4 CIRCUIT 600M	671
2451300850 Woodhead - Molex	8 CIRCUIT 5M NANOFIT OVERMOLDED	111
0451110205 Woodhead - Molex	MICROLOCK PLUS CABLE BLACK 2 CKT	0
2147552083 Woodhead - Molex	MICRO-FIT3.0 R-R 8 CIRCUIT 600MM	588
2147572021 Woodhead - Molex	MICRO-FIT3.0 P-P 2 CIRCUIT 150MM	150
0151330200 Woodhead - Molex	PICO-CLASP 2 CIRCUIT 50MM	0
2451360820 Woodhead - Molex	MEGAFIT 8CKT BLACK 2M OVERMOLDED	0
0369240310 Woodhead - Molex	MINIFIT-SR 3 CIRCUIT 1000MM	200
0151370202 Woodhead - Molex	MINI-LOCK-TO-MINI-LOCK OFF-THE-S	852
2153221042 Woodhead - Molex	MINIFIT JR SR M-M 4 CIRCUIT 300M	75
0369220506 Woodhead - Molex	DITTO 5 CIRCUIT WTW 600MM	75
0923161026 Woodhead - Molex	10CKT PICOFLEX 260MM LONG	0
2174661062 Woodhead - Molex	ULTRA-FIT SR R-S 6CKT 300MM DISC	0
2153222033 Woodhead - Molex	MINIFIT JR SR M-M 3 CIRCUIT 600M	50
0151310205 Woodhead - Molex	CABLE-ASSY PICOLOCK 2 CIRCUIT 45	825
2451300210 Woodhead - Molex	2 CIRCUIT 1M NANOFIT OVERMOLDED	372
2153271101 Woodhead - Molex	MINIFIT JR DR P-P 10 CIRCUIT 150	0
2147561021 Woodhead - Molex	MICRO-FIT3.0 R-S 2 CIRCUIT 150MM	130

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
D-Subminiature	Metal-shielded, screw-locking design	Industrial computers, military equipment
IDC (Insulation Displacement)	Tool-less termination, flat cable compatibility	Telecom switches, HVAC systems
Board-to-Board	Low-profile, high-pin-count options	Servers, medical imaging devices
Ribbon Cable	Parallel signal routing, flexible dielectric	Computer peripherals, test equipment

3. Structure and Components

Typical construction includes:

Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
Shielding: Braided copper or conductive polymer layers
Strain relief: Molded thermoplastic overbraiding
Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

Parameter	Typical Range	Importance
Rated Voltage	50V - 600V	Ensures dielectric safety
Current Capacity	1A - 15A per contact	Determines power handling
Contact Resistance	5-20m	Impacts signal integrity
Insulation Resistance	100M - 10G	Prevents leakage currents
Operating Temperature	-55 C to +125 C	Environmental reliability
Mating Cycles	500 - 5000 cycles	Durability indicator

5. Application Fields

Primary sectors include:

Computer & Peripherals: Server backplanes, GPU interconnects
Telecommunications: 5G base stations, optical network terminals
Industrial Automation: PLC interfaces, robotic controllers
Medical Equipment: MRI scanners, diagnostic devices
Transportation: EV battery management systems, avionics

6. Leading Manufacturers

Manufacturer	Key Products
Amphenol Corporation	D-Sub 90 PCB Mount Series
TE Connectivity	MATE-AX High-Speed Backplane Cables
Molex LLC	PicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.	QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

Electrical requirements (voltage/current profiles)
Mechanical constraints (space limitations, vibration exposure)
Environmental factors (temperature extremes, chemical exposure)
Signal integrity needs (impedance control, crosstalk reduction)
Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

Miniaturization: 0.4mm pitch connectors for mobile devices
High-speed capabilities: 25+ Gbps differential pair designs
Smart integration: Embedded sensors for condition monitoring
Sustainability focus: Halogen-free materials adoption
Automated manufacturing: AI-driven quality control systems