Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
2162921061

2162921061

Woodhead - Molex

STANDARD .093 6 CIRCUIT P TO P 1

0

2162701033

2162701033

Woodhead - Molex

SL POSITIVE LOCK R-R 3CKT 300MM

0

0451110500

0451110500

Woodhead - Molex

MICROLOCK PLUS CABLE BLACK 5 CKT

284

2147562082

2147562082

Woodhead - Molex

MICRO-FIT3.0 R-S 8 CIRCUIT 300MM

72

2162931023

2162931023

Woodhead - Molex

STANDARD .093 2 CIRCUIT P TO S 6

0

2147581101

2147581101

Woodhead - Molex

MICRO-FIT3.0 P-S 10 CIRCUIT 150M

0

2153272103

2153272103

Woodhead - Molex

MINIFIT JR DR P-P 10 CIRCUIT 600

0

2451300830

2451300830

Woodhead - Molex

8 CIRCUIT 3M NANOFIT OVERMOLDED

117

1451320410

1451320410

Woodhead - Molex

MICRO-FIT TPA-TO-MICRO-FIT TPA O

949

0151340501

0151340501

Woodhead - Molex

PICOBLADE 5 CIRCUIT 100MM

0

2174651061

2174651061

Woodhead - Molex

ULTRA-FIT SR R-R 6CKT 150MM DISC

0

2162821023

2162821023

Woodhead - Molex

MX150 P-P SR 2CKT 600MM SN SEALE

0

1451350303

1451350303

Woodhead - Molex

MINI-FIT 3 CIRCUIT 300MM

66

2162721050

2162721050

Woodhead - Molex

SL POSITIVE LOCK P-P 5CKT 50MM S

0

0451110503

0451110503

Woodhead - Molex

MICROLOCK PLUS CABLE BLACK 5 CKT

822

0151370203

0151370203

Woodhead - Molex

MINI-LOCK-TO-MINI-LOCK OFF-THE-S

875

2153202041

2153202041

Woodhead - Molex

MINIFIT JR SR R-R 4 CIRCUIT 150M

500

0151320703

0151320703

Woodhead - Molex

CABLE ASSY PICOLOCK 7 POS 300MM

1865

2174661021

2174661021

Woodhead - Molex

ULTRA-FIT SR R-S 2CKT 150MM DISC

0

0151370503

0151370503

Woodhead - Molex

MINI-LOCK-TO-MINI-LOCK OFF-THE-S

1033

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
RFQ BOM Call Skype Email
Top