Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
2162731061

2162731061

Woodhead - Molex

SL POSITIVE LOCK P-S 6CKT 100MM

0

2153221043

2153221043

Woodhead - Molex

MINIFIT JR SR M-M 4 CIRCUIT 600M

500

2451350820

2451350820

Woodhead - Molex

MINIFIT JR 8 CIRCUIT BLACK 2M

216

2153222031

2153222031

Woodhead - Molex

MINIFIT JR SR M-M 3 CIRCUIT 150M

75

2153121033

2153121033

Woodhead - Molex

MIZU-P25 P-P 3CKT 600MM SN

0

2153221041

2153221041

Woodhead - Molex

MINIFIT JR SR M-M 4 CIRCUIT 150M

500

0151330306

0151330306

Woodhead - Molex

PICO-CLASP 3 CIRCUIT 600MM

1551

0369210303

0369210303

Woodhead - Molex

L1NK 396 3 CIRCUIT 300MM

188

2163311084

2163311084

Woodhead - Molex

EDGE LOCK R-S 8CKT 600MM SN

0

2163301042

2163301042

Woodhead - Molex

EDGE LOCK R-R 4CKT 150MM SN

0

2147571022

2147571022

Woodhead - Molex

MICRO-FIT3.0 P-P 2 CIRCUIT 300MM

188

2162711033

2162711033

Woodhead - Molex

SL POSITIVE LOCK R-S 3CKT 300MM

0

1451300301

1451300301

Woodhead - Molex

NANO-FIT-TO-NANO-FIT OFF-THE-SHE

786

2147551101

2147551101

Woodhead - Molex

MICRO-FIT3.0 R-R 10 CIRCUIT 150M

73

0923150450

0923150450

Woodhead - Molex

4CKT PICOFLEX HARNESS 500MM LONG

0

0923151602

0923151602

Woodhead - Molex

16CKT PICOFLEX 1050MM LONG

0

2162701031

2162701031

Woodhead - Molex

SL POSITIVE LOCK R-R 3CKT 100MM

0

2162721032

2162721032

Woodhead - Molex

SL POSITIVE LOCK P-P 3CKT 150MM

0

2162701023

2162701023

Woodhead - Molex

SL POSITIVE LOCK R-R 2CKT 300MM

0

2147512021

2147512021

Woodhead - Molex

MICROFIT 3.0 SR R-S 2CKT 150 MM

888

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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