Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
2153211031

2153211031

Woodhead - Molex

MINIFIT JR SR R-S 3 CIRCUIT 150M

100

2163311021

2163311021

Woodhead - Molex

EDGE LOCK R-S 2CKT 100MM SN

0

2153261103

2153261103

Woodhead - Molex

MINIFIT JR DR R-S 10 CIRCUIT 600

0

0511100850-20-A-6-X

0511100850-20-A-6-X

Woodhead - Molex

8 CIRC CABLE ASSY 20" X

9

2153121032

2153121032

Woodhead - Molex

MIZU-P25 P-P 3CKT 300MM SN

0

2147511023

2147511023

Woodhead - Molex

MICROFIT 3.0 SR R-S 2CKT 600 MM

500

0511100650-30-A-6-X

0511100650-30-A-6-X

Woodhead - Molex

6 CIRC CABLE ASSY 30" X

17

0451301003

0451301003

Woodhead - Molex

NANO-FIT 10CIRCUIT 300MM

405

2153121023

2153121023

Woodhead - Molex

MIZU-P25 P-P 2CKT 600MM SN

0

2153131031

2153131031

Woodhead - Molex

MIZU-P25 P-S 3CKT 150MM SN

0

2162861061

2162861061

Woodhead - Molex

MX150 R-S DR 6CKT 150MM SN SEALE

0

2147571023

2147571023

Woodhead - Molex

MICRO-FIT3.0 P-P 2 CIRCUIT 600MM

2785

0369210200

0369210200

Woodhead - Molex

L1NK 396 2 CIRCUIT 75MM

232

2451320620

2451320620

Woodhead - Molex

MICROFIT 6 CIRCUIT BLACK 2M OVER

626

2451350220

2451350220

Woodhead - Molex

MINIFIT JR 2 CIRCUIT BLACK 2M

236

2451350210

2451350210

Woodhead - Molex

MINIFIT JR 2 CIRCUIT BLACK 1M

268

2153282082

2153282082

Woodhead - Molex

MINIFIT JR DR P-S 8 CIRCUIT 300M

0

0151320702

0151320702

Woodhead - Molex

CABLE ASSY PICOLOCK 7 POS 150MM

384

2153131042

2153131042

Woodhead - Molex

MIZU-P25 P-S 4CKT 300MM SN

0

0151371003

0151371003

Woodhead - Molex

MINI-LOCK-TO-MINI-LOCK OFF-THE-S

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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