Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
2147552101

2147552101

Woodhead - Molex

MICRO-FIT3.0 R-R 10 CIRCUIT 150M

14

2162831022

2162831022

Woodhead - Molex

MX150 P-S SR 2CKT 300MM SN SEALE

0

2153251062

2153251062

Woodhead - Molex

MINIFIT JR DR R-R 6 CIRCUIT 300M

0

1451350500

1451350500

Woodhead - Molex

MINI-FIT 5 CIRCUIT 75MM

97

2162721043

2162721043

Woodhead - Molex

SL POSITIVE LOCK P-P 4CKT 300MM

0

2162731030

2162731030

Woodhead - Molex

SL POSITIVE LOCK P-S 3CKT 50MM S

0

2153252083

2153252083

Woodhead - Molex

MINIFIT JR DR R-R 8 CIRCUIT 600M

0

0151341001

0151341001

Woodhead - Molex

PICOBLADE 10 CIRCUIT 100MM

601

2153211053

2153211053

Woodhead - Molex

MINIFIT JR SR R-S 5 CIRCUIT 600M

47

2153211032

2153211032

Woodhead - Molex

MINIFIT JR SR R-S 3 CIRCUIT 300M

88

1502070012

1502070012

Woodhead - Molex

DITTO SG/END HARNESS 6 CKT .15M

0

0151360502

0151360502

Woodhead - Molex

MICROCLASP 5 CIRCUIT 150MM

0

2162901063

2162901063

Woodhead - Molex

STANDARD .093 6 CIRCUIT R TO R 6

0

0151330205

0151330205

Woodhead - Molex

PICO-CLASP 2 CIRCUIT 450MM

494

2162801022

2162801022

Woodhead - Molex

MX150 R-R SR 2CKT 300MM SN SEALE

0

2153202032

2153202032

Woodhead - Molex

MINIFIT JR SR R-R 3 CIRCUIT 300M

75

2153222032

2153222032

Woodhead - Molex

MINIFIT JR SR M-M 3 CIRCUIT 300M

50

0151360506

0151360506

Woodhead - Molex

MICROCLASP 5 CIRCUIT 600MM

731

0151330405

0151330405

Woodhead - Molex

PICO-CLASP 4 CIRCUIT 450MM

424

2153211041

2153211041

Woodhead - Molex

MINIFIT JR SR R-S 4 CIRCUIT 150M

498

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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