Rectangular Cable Assemblies

Part Number	Description / PDF	Quantity
2147532103 Woodhead - Molex	MICROFIT 3.0 SR P-S 10CKT 600 MM	125
2147561102 Woodhead - Molex	MICRO-FIT3.0 R-S 10 CIRCUIT 300M	46
0923151610 Woodhead - Molex	16CC PICOFLEX 100MM LONG	2495
2162921062 Woodhead - Molex	STANDARD .093 6 CIRCUIT P TO P 3	0
0369240401 Woodhead - Molex	MINIFIT-SR 4 CIRCUIT 150MM	199
2162911043 Woodhead - Molex	STANDARD .093 4 CIRCUIT R TO S 6	0
0369220601 Woodhead - Molex	DITTO 6 CIRCUIT WTW 100MM	100
0451360401 Woodhead - Molex	MEGA-FIT 4 CIRCUIT 150MM	275
2147552023 Woodhead - Molex	MICRO-FIT3.0 R-R 2 CIRCUIT 600MM	1241
2153261102 Woodhead - Molex	MINIFIT JR DR R-S 10 CIRCUIT 300	0
2153271062 Woodhead - Molex	MINIFIT JR DR P-P 6 CIRCUIT 300M	0
2174651051 Woodhead - Molex	ULTRA-FIT SR R-R 5CKT 150MM DISC	0
0369200501 Woodhead - Molex	PICOEZMATE 5 CIRCUIT 100MM	425
2162831031 Woodhead - Molex	MX150 P-S SR 3CKT 150MM SN SEALE	0
0151370302 Woodhead - Molex	MINI-LOCK-TO-MINI-LOCK OFF-THE-S	28
2147551102 Woodhead - Molex	MICRO-FIT3.0 R-R 10 CIRCUIT 300M	25
0151360701 Woodhead - Molex	MICROCLASP 7 CIRCUIT 100MM	0
2164001062 Woodhead - Molex	MEGAFIT SR R-R 6 CKT 300 MM CABL	0
2147582043 Woodhead - Molex	MICRO-FIT3.0 P-S 4 CIRCUIT 600MM	0
2163301023 Woodhead - Molex	EDGE LOCK R-R 2CKT 300MM SN	0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
D-Subminiature	Metal-shielded, screw-locking design	Industrial computers, military equipment
IDC (Insulation Displacement)	Tool-less termination, flat cable compatibility	Telecom switches, HVAC systems
Board-to-Board	Low-profile, high-pin-count options	Servers, medical imaging devices
Ribbon Cable	Parallel signal routing, flexible dielectric	Computer peripherals, test equipment

3. Structure and Components

Typical construction includes:

Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
Shielding: Braided copper or conductive polymer layers
Strain relief: Molded thermoplastic overbraiding
Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

Parameter	Typical Range	Importance
Rated Voltage	50V - 600V	Ensures dielectric safety
Current Capacity	1A - 15A per contact	Determines power handling
Contact Resistance	5-20m	Impacts signal integrity
Insulation Resistance	100M - 10G	Prevents leakage currents
Operating Temperature	-55 C to +125 C	Environmental reliability
Mating Cycles	500 - 5000 cycles	Durability indicator

5. Application Fields

Primary sectors include:

Computer & Peripherals: Server backplanes, GPU interconnects
Telecommunications: 5G base stations, optical network terminals
Industrial Automation: PLC interfaces, robotic controllers
Medical Equipment: MRI scanners, diagnostic devices
Transportation: EV battery management systems, avionics

6. Leading Manufacturers

Manufacturer	Key Products
Amphenol Corporation	D-Sub 90 PCB Mount Series
TE Connectivity	MATE-AX High-Speed Backplane Cables
Molex LLC	PicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.	QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

Electrical requirements (voltage/current profiles)
Mechanical constraints (space limitations, vibration exposure)
Environmental factors (temperature extremes, chemical exposure)
Signal integrity needs (impedance control, crosstalk reduction)
Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

Miniaturization: 0.4mm pitch connectors for mobile devices
High-speed capabilities: 25+ Gbps differential pair designs
Smart integration: Embedded sensors for condition monitoring
Sustainability focus: Halogen-free materials adoption
Automated manufacturing: AI-driven quality control systems