Static Control Shielding Bags, Materials

Part Number	Description / PDF	Quantity
13630 EMIT	BAG ESD SHLD 5"X8" METAL-IN ZIP	59752
49115 EMIT	BAG PINK POLY 4MIL 14X16 NO ZIP	0
12913 EMIT	BAG STATIC SHIELD MTL IN 6"X8"	267920
13951 EMIT	BG MBB FOIL 4MIL 10X30" 100EA/PK	16
13806 EMIT	ESD BAG VAPOR BARRIER 5"X8"	250
13807 EMIT	BAG SHIELDING MVB 5X30 100PC	25
13528 EMIT	BAG SHIELD METAL-IN 20X24	30
12916 EMIT	BAG STATIC SHIELD MTL IN 8"X12"	120023
12931 EMIT	STATIC SHIELD BAG,81705 SERIES M	7
12809 EMIT	ESD SHLD BUBBLE BAG 14X15 10PK	0
13773 EMIT	MST BARRIER 16X18" 6.5MIL 100PK	30
13829 EMIT	BAG SHIELDING MVB 16X18	34
12734 EMIT	BAG SHLD METAL-IN 14X16	0
PCL1002024 EMIT	STATIC SHIELD BAG, PCL100 CLEAN	3
13516 EMIT	BAG SHIELD METAL-IN 16X18 100PC	30
13300 EMIT	BAG SHLD MET-OUT ZIP 12X16	50
13811 EMIT	BAG SHIELDING MVB 6X30	21
13440 EMIT	BAG SHIELD METAL-IN 6X8	454
13824 EMIT	BAG ESD VAPOR BARRIER 12"X16"	1493550
12924 EMIT	BAG STATIC SHIELD MTL IN 18"X20"	76012

Static Control Shielding Bags, Materials

1. Overview

Static control shielding bags and materials are specialized packaging solutions designed to protect sensitive electronic components from electrostatic discharge (ESD), electromagnetic interference (EMI), and environmental contaminants. These products are critical in industries where electrostatic sensitive devices (ESDS) require protection during storage, handling, and transportation. Their importance has grown exponentially with the miniaturization of electronic circuits and the increasing prevalence of high-speed semiconductor devices.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Metal-in-Film Shielding Bags	Multi-layer construction with aluminum/polymer layers for EMI/RFI shielding and ESD protection	IC packaging, PCB transport
Conductive Polyethylene Bags	Carbon-loaded plastic with surface resistance 10 -10	Low-voltage electronics packaging
Anti-Static Barrier Materials	Multi-layer films with static decay <2s and low particle emission	Medical device packaging
EMI/RFI Shielding Gaskets	Conductive elastomers with shielding effectiveness >60dB	Aerospace equipment enclosures

3. Structure and Composition

Typical shielding bags employ a 3-5 layer construction:

Outer layer: PET or nylon for mechanical protection
Conductive layer: Aluminum coating (0.02-0.05mm)
Dielectric layer: Polyethylene terephthalate (PET)
ESD dissipative inner layer: Carbon-loaded polymer or conductive adhesive

Advanced materials incorporate nanotechnology coatings (e.g., silver nanowires) for improved shielding performance while maintaining optical transparency.

4. Key Technical Parameters

Parameter	Typical Value	Importance
Shielding Effectiveness	30-100 dB (100kHz-10GHz)	Protects against EMI/RFI interference
Surface Resistance	10 -10 /sq	Determines ESD dissipation rate
Charge Decay Time	<2 seconds	Time to neutralize 1kV charge
Particle Emission	<10 particles/ft (ISO Class 4)	Cleanroom compatibility

5. Application Fields

Key industries include:

Semiconductor manufacturing (wafer transport, die packaging)
Aerospace (avionics component protection)
Medical devices (implantable electronics packaging)
Data centers (server hardware transportation)

Typical equipment protected: ICs (CSP/BGA packages), MEMS sensors, RF modules, optical transceivers.

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Desco Industries	Alpha Shield III	3-layer metalized film, 50dB shielding
3M	ESD Shielding Bag 3600	Transparent EMI shielding, 10 surface resistance
Able Electropolish	EMI-STAT	Stainless steel fiber composite, 80dB performance

7. Selection Guidelines

Key selection factors:

ESDS sensitivity level (voltage tolerance of protected device)
Environmental conditions (temperature, humidity, contamination level)
Shielding frequency range requirements
Material compatibility (outgassing characteristics for vacuum environments)
Compliance with industry standards (ANSI/ESD S541, MIL-PRF-81705E)

Case study: A semiconductor fab achieved 98% defect reduction by switching to metal-in-film bags with <1s charge decay time for 28nm node wafer transport.

8. Industry Trends

Emerging trends include:

Development of resealable smart packaging with integrated ESD monitoring
Graphene-based composite materials for lighter weight shielding
Nano-coating technologies enabling transparent EMI protection
Increased adoption of IPC-J-STD-033D compliant moisture barrier packaging
Growth in demand for flexible hybrid shielding solutions combining conductive polymers with metal meshes

Market projections indicate 6.2% CAGR through 2027 driven by 5G infrastructure and automotive electronics growth.