Static Control Shielding Bags, Materials

Part Number	Description / PDF	Quantity
13506 EMIT	BAG SHIELD METAL-IN 12X24	57
12928 EMIT	BAG STATIC SHIELD MTL IN 4"X6"	499518
13416 EMIT	BAG SHIELD METAL-IN 4X8 100PC	190
13950 EMIT	BG MBB FOIL 4MIL 10X20" 100EA/PK	12
13822 EMIT	BAG SHIELDING MVB 10X30	33
13645 EMIT	BAG ESD SHLD 6"X10" METAL-IN ZIP	1218247
13955 EMIT	BG MBB FOIL 4MIL 18X20" 100EA/PK	38
13776 EMIT	MST BARRIER 20X20" 6.5MIL 100PK	14
13443 EMIT	BAG SHIELD METAL-IN 6X12	245155
13873 EMIT	BAG DISS CLEAR 8X10	147
12929 EMIT	BAG STATIC SHIELD MTL IN 8"X10"	489012
13615 EMIT	BAG ESD SHLD 4"X6" METAL-IN ZIP	51694182
13805 EMIT	BAG SHIELDING MVB 4X24 100PC	70
12912 EMIT	BAG STATIC SHIELD MTL IN 5"X8"	15809
13403 EMIT	BAG SHIELD METAL-IN 2X6 100PC	222
13420 EMIT	BAG SHIELD METAL-IN 4X24	159
13320 EMIT	BAG SHLD MET-OUT ZIP 18X18 100PC	20
13215 EMIT	BAG SHLD METAL-OUT ZIP 4X6	616
13960 EMIT	MBB IPC/JEDEC 4MIL 10X20" 100/PK	3
13820 EMIT	BAG SHIELDING MVB 10X24	26

Static Control Shielding Bags, Materials

1. Overview

Static control shielding bags and materials are specialized packaging solutions designed to protect sensitive electronic components from electrostatic discharge (ESD), electromagnetic interference (EMI), and environmental contaminants. These products are critical in industries where electrostatic sensitive devices (ESDS) require protection during storage, handling, and transportation. Their importance has grown exponentially with the miniaturization of electronic circuits and the increasing prevalence of high-speed semiconductor devices.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Metal-in-Film Shielding Bags	Multi-layer construction with aluminum/polymer layers for EMI/RFI shielding and ESD protection	IC packaging, PCB transport
Conductive Polyethylene Bags	Carbon-loaded plastic with surface resistance 10 -10	Low-voltage electronics packaging
Anti-Static Barrier Materials	Multi-layer films with static decay <2s and low particle emission	Medical device packaging
EMI/RFI Shielding Gaskets	Conductive elastomers with shielding effectiveness >60dB	Aerospace equipment enclosures

3. Structure and Composition

Typical shielding bags employ a 3-5 layer construction:

Outer layer: PET or nylon for mechanical protection
Conductive layer: Aluminum coating (0.02-0.05mm)
Dielectric layer: Polyethylene terephthalate (PET)
ESD dissipative inner layer: Carbon-loaded polymer or conductive adhesive

Advanced materials incorporate nanotechnology coatings (e.g., silver nanowires) for improved shielding performance while maintaining optical transparency.

4. Key Technical Parameters

Parameter	Typical Value	Importance
Shielding Effectiveness	30-100 dB (100kHz-10GHz)	Protects against EMI/RFI interference
Surface Resistance	10 -10 /sq	Determines ESD dissipation rate
Charge Decay Time	<2 seconds	Time to neutralize 1kV charge
Particle Emission	<10 particles/ft (ISO Class 4)	Cleanroom compatibility

5. Application Fields

Key industries include:

Semiconductor manufacturing (wafer transport, die packaging)
Aerospace (avionics component protection)
Medical devices (implantable electronics packaging)
Data centers (server hardware transportation)

Typical equipment protected: ICs (CSP/BGA packages), MEMS sensors, RF modules, optical transceivers.

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Desco Industries	Alpha Shield III	3-layer metalized film, 50dB shielding
3M	ESD Shielding Bag 3600	Transparent EMI shielding, 10 surface resistance
Able Electropolish	EMI-STAT	Stainless steel fiber composite, 80dB performance

7. Selection Guidelines

Key selection factors:

ESDS sensitivity level (voltage tolerance of protected device)
Environmental conditions (temperature, humidity, contamination level)
Shielding frequency range requirements
Material compatibility (outgassing characteristics for vacuum environments)
Compliance with industry standards (ANSI/ESD S541, MIL-PRF-81705E)

Case study: A semiconductor fab achieved 98% defect reduction by switching to metal-in-film bags with <1s charge decay time for 28nm node wafer transport.

8. Industry Trends

Emerging trends include:

Development of resealable smart packaging with integrated ESD monitoring
Graphene-based composite materials for lighter weight shielding
Nano-coating technologies enabling transparent EMI protection
Increased adoption of IPC-J-STD-033D compliant moisture barrier packaging
Growth in demand for flexible hybrid shielding solutions combining conductive polymers with metal meshes

Market projections indicate 6.2% CAGR through 2027 driven by 5G infrastructure and automotive electronics growth.