Static Control Shielding Bags, Materials

Part Number	Description / PDF	Quantity
13090 EMIT	BAG SHIELD METAL-OUT 10X24	26
13963 EMIT	MBB IPC/JEDEC 4MIL 14X16" 100/PK	75
13779 EMIT	MST BARRIER 32X30" 6.5MIL 100PK	12
13828 EMIT	BAG SHIELDING MVB 15X18	26
12930 EMIT	STATIC SHIELD BAG,81705 SERIES M	98
13465 EMIT	BAG SHIELD METAL-IN 8X12	4050423
49113 EMIT	BAG PINK POLY 4MIL 10X20 NO ZIP	0
12914 EMIT	BAG STATIC SHIELD MTL IN 8"X8"	211754
12921 EMIT	BAG STATIC SHIELD MTL IN 12"X18"	160221
13450 EMIT	BAG SHIELD METAL-IN 6X30	23
13830 EMIT	BAG SHIELDING MVB 18X18	20
12925 EMIT	BAG STATIC SHIELD MTL IN 18"X24"	11493
12910 EMIT	BAG STATIC SHIELD MTL IN 3"X5"	338329
13769 EMIT	BAG EMI/RFI MVB 6MIL 18X18	10
13408 EMIT	BAG SHIELD METAL-IN 3X7 100PK	0
13511 EMIT	BAG SHIELD METAL-IN 14X20 100PC	20
13660 EMIT	BAG ESD SHLD 8"X10" METAL-IN ZIP	126394
13765 EMIT	BAG EMI/RFI MVB 6MIL 10X24	25
PCL100R 36X100 EMIT	FILM STATIC SHIELD PCL100 CLEAN	4
13457 EMIT	BAG SHIELD METAL-IN 7X15	209

Static Control Shielding Bags, Materials

1. Overview

Static control shielding bags and materials are specialized packaging solutions designed to protect sensitive electronic components from electrostatic discharge (ESD), electromagnetic interference (EMI), and environmental contaminants. These products are critical in industries where electrostatic sensitive devices (ESDS) require protection during storage, handling, and transportation. Their importance has grown exponentially with the miniaturization of electronic circuits and the increasing prevalence of high-speed semiconductor devices.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Metal-in-Film Shielding Bags	Multi-layer construction with aluminum/polymer layers for EMI/RFI shielding and ESD protection	IC packaging, PCB transport
Conductive Polyethylene Bags	Carbon-loaded plastic with surface resistance 10 -10	Low-voltage electronics packaging
Anti-Static Barrier Materials	Multi-layer films with static decay <2s and low particle emission	Medical device packaging
EMI/RFI Shielding Gaskets	Conductive elastomers with shielding effectiveness >60dB	Aerospace equipment enclosures

3. Structure and Composition

Typical shielding bags employ a 3-5 layer construction:

Outer layer: PET or nylon for mechanical protection
Conductive layer: Aluminum coating (0.02-0.05mm)
Dielectric layer: Polyethylene terephthalate (PET)
ESD dissipative inner layer: Carbon-loaded polymer or conductive adhesive

Advanced materials incorporate nanotechnology coatings (e.g., silver nanowires) for improved shielding performance while maintaining optical transparency.

4. Key Technical Parameters

Parameter	Typical Value	Importance
Shielding Effectiveness	30-100 dB (100kHz-10GHz)	Protects against EMI/RFI interference
Surface Resistance	10 -10 /sq	Determines ESD dissipation rate
Charge Decay Time	<2 seconds	Time to neutralize 1kV charge
Particle Emission	<10 particles/ft (ISO Class 4)	Cleanroom compatibility

5. Application Fields

Key industries include:

Semiconductor manufacturing (wafer transport, die packaging)
Aerospace (avionics component protection)
Medical devices (implantable electronics packaging)
Data centers (server hardware transportation)

Typical equipment protected: ICs (CSP/BGA packages), MEMS sensors, RF modules, optical transceivers.

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Desco Industries	Alpha Shield III	3-layer metalized film, 50dB shielding
3M	ESD Shielding Bag 3600	Transparent EMI shielding, 10 surface resistance
Able Electropolish	EMI-STAT	Stainless steel fiber composite, 80dB performance

7. Selection Guidelines

Key selection factors:

ESDS sensitivity level (voltage tolerance of protected device)
Environmental conditions (temperature, humidity, contamination level)
Shielding frequency range requirements
Material compatibility (outgassing characteristics for vacuum environments)
Compliance with industry standards (ANSI/ESD S541, MIL-PRF-81705E)

Case study: A semiconductor fab achieved 98% defect reduction by switching to metal-in-film bags with <1s charge decay time for 28nm node wafer transport.

8. Industry Trends

Emerging trends include:

Development of resealable smart packaging with integrated ESD monitoring
Graphene-based composite materials for lighter weight shielding
Nano-coating technologies enabling transparent EMI protection
Increased adoption of IPC-J-STD-033D compliant moisture barrier packaging
Growth in demand for flexible hybrid shielding solutions combining conductive polymers with metal meshes

Market projections indicate 6.2% CAGR through 2027 driven by 5G infrastructure and automotive electronics growth.