Clean Room Swabs and Brushes

Image Part Number Description / PDF Quantity Rfq
0906-12000

0906-12000

SIZ 12 PUR RED SAB RD ART; WD HD

0

901715HH

901715HH

1" FLOW-THRU; HH FILL; MALE

0

38040ESD

38040ESD

ITW Chemtronics (Chemtronics)

SEALED POLY SWABS 500/PK

26

SST10NG-12

SST10NG-12

APPLICATOR: NYLON FILL; SS HNDLE

0

FTC-16

FTC-16

16GAUG; FT LUER LOCK; CAMEL FILL

0

AB8

AB8

ACID BRUSH; HH; TIN HDL; 7/8" TR

0

35686

35686

Tronex (Menda/EasyBraid/Tronex)

BRUSH DISSIPATIVE FLAT NYLON 1"

1235

G1308HHP

G1308HHP

BLOCK BRUSH; HH FILL; PLAST BASE

0

SST12TEF

SST12TEF

APPLICATOR: PTFE FILL; SS HANDLE

0

444SS006G

444SS006G

PLATER'S BRUSH; SS FILL; WOOD HD

0

SST12PP

SST12PP

APPLICATOR: POLY FILL; SS HANDLE

0

6080-10000

6080-10000

SIZE 10 SABELINE ARTIST; WD HDLE

0

36061I

36061I

ITW Chemtronics (Chemtronics)

SWAB SGL HEAD POLY KNIT 375PC

0

15CKLG-12

15CKLG-12

HL TOOTHBRUSH; HOG FILL; WOOD HD

0

EB14SD

EB14SD

END BRUSH; SD NY FILL; STEEL BOD

0

906500

906500

INSTR CLNR; NYL FILL; PLAST HDLE

0

LBF-5HH

LBF-5HH

5/8" FLOW-THRU; HH FILL; FEMALE

0

0906-04000

0906-04000

SIZE 4 PUR RED SAB RD ART; WD HD

0

901735

901735

23" PUSH FLOOR BROOM SD NYL FILL

0

9162HH

9162HH

BLOCK BRUSH; HH FILL; WOOD BASE

0

Clean Room Swabs and Brushes

1. Overview

Clean room swabs and brushes are specialized tools designed for contamination control in controlled environments. They play a critical role in removing particulate and electrostatic discharge (ESD) hazards from sensitive surfaces in semiconductor manufacturing, pharmaceutical production, and aerospace engineering. These products must meet stringent ISO 14644-1 and IEST standards for particle generation, chemical compatibility, and electrostatic dissipation.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Foam-Tip Swabs High absorbency, low particle generation, non-abrasive Optical lens cleaning, precision electronics assembly
Microfiber Brushes Split-fiber structure for superior particle capture HEPA filter maintenance, cleanroom wall cleaning
ESD-Neutral Swabs Conductive carbon fibers, static-dissipative handles Wafer processing equipment cleaning, PCB assembly
Ultrasonic Clean Brushes Engineered for compatibility with ultrasonic cleaning systems Medical device sterilization, semiconductor tooling maintenance

3. Structure and Composition

Typical swabs consist of three primary components: (1) Cleaning medium (foam, microfiber, or nonwoven fabric), (2) Handle material (polypropylene, conductive polymer, or stainless steel), and (3) Bonding agent (solvent-free adhesive for ISO Class 3 environments). Brushes feature filament arrays (nylon with PTFE coating, carbon-infused polypropylene) mounted on ESD-safe polymer bases. All materials undergo outgassing testing per ASTM E595 standards.

4. Key Technical Specifications

Parameter Acceptance Criteria Importance
Particle Shedding (0.5 m+) <10 particles/cm Maintains ISO Class 3 environment integrity
ESD Decay Time <1.0 second Protects ESD-sensitive electronics
Chemical Extractables <0.01% by weight Prevents process contamination
Thermal Stability Operable from -40 C to 121 C Enables sterilization compatibility

5. Application Fields

Primary industries include: semiconductor fabrication (ASML immersion lithography tools), biopharmaceutical manufacturing (Grade A/B isolators), aerospace (NASA JPL Class 100 cleanrooms), and precision optics (Zeiss electron microscopes). Critical applications involve photomask cleaning, aseptic filling line maintenance, and MEMS device calibration.

6. Leading Manufacturers and Products

Manufacturer Key Product Technical Highlights
Texwipe TX1010 Cleanroom Swabs Gamma-stable polyester foam, 10-6 particle count
Aero-Mist ESD-700 Brush Kit Carbon-loaded nylon filaments, 108 surface resistance
Bondline Ultraclean Swabs Single-bonded PU tip, <1ppm NVR
Kimberly-Clark KimWipes CR-TX 99.99% isopropyl alcohol compatibility

7. Selection Recommendations

Key considerations include: (1) Surface sensitivity (e.g., 10nm particle removal efficiency for EUV lithography mirrors), (2) Chemical compatibility (resistance to 5% HF acid solutions), (3) ESD requirements (IEC 61340-5-1 compliance), and (4) Lifecycle cost (sterilization reusability vs. single-use economics). For critical applications like 5nm node manufacturing, carbon-fiber reinforced swabs with sub-100nm particle retention are recommended.

8. Industry Trends

Current developments focus on: (1) Nanofiber-based cleaning media with 99.999% BFE efficiency, (2) Smart brushes with embedded sensors for real-time contamination monitoring, (3) Biodegradable polymer handles reducing environmental impact, and (4) Integration with robotic cleaning systems for ISO Class 1 environments. The market is projected to grow at 8.7% CAGR through 2027, driven by 3D NAND flash manufacturing and biopharma single-use systems.

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