Clean Room Swabs and Brushes

Image Part Number Description / PDF Quantity Rfq
2302-1000

2302-1000

Techspray

ABSORB-TIP FOAM SWAB

0

1.25 SWAB

1.25 SWAB

Tempo Communications

1.25MM CLEANING SWAB (100 PACK)

8

1S9

1S9

APPLICATOR; SD NYL FILL; STL HDL

0

CT5000

CT5000

ITW Chemtronics (Chemtronics)

SWAB SGL HEAD COTTON 6" 1000PC

0

23203

23203

SIZE 7 NYLON STRIP BRUSH, 4" HT

0

35689

35689

Tronex (Menda/EasyBraid/Tronex)

BRUSH DISSIPAT CURVE HNDL 3X1.5"

675

906500S9X

906500S9X

INSTR CLNR; SD NY FILL; PL HNDLE

0

BT203G

BT203G

APPLICATOR: GOAT FILL; BRASS HDL

0

906502HH

906502HH

INSTR CLNR; HH FILL; PLAST HDLE

0

CC50

CC50

ITW Chemtronics (Chemtronics)

CHAMOIS TIP 3.25" 50 PIECE PACK

42

146644

146644

APPLICATOR: SS FILL; SS HANDLE

0

33SDA

33SDA

HL TOOTHBRUSH; SD NY FILL; AL HD

0

SST6NG-12

SST6NG-12

APPLICATOR: NYLON FILL; SS HNDLE

0

FTWT-18

FTWT-18

18G; FT LUER LOCK; WHT TAK FILL

0

443SSG

443SSG

SCRATCH BRUSH; SS FILL; WOOD HDL

0

6020-06000

6020-06000

SIZE 6 CAMEL RND ARTIST; WD HDLE

0

38540

38540

ITW Chemtronics (Chemtronics)

SWAB SGL HEAD POLY NONWVN 2500PC

0

49280

49280

ITW Chemtronics (Chemtronics)

SWAB SGL HEAD FOAM 6.5" 2500PC

0

375S9X

375S9X

APPLICATOR; SD NYL FILL; STL HDL

0

60HH

60HH

HL TOOTH BR; HH FILL; WOOD HNDLE

0

Clean Room Swabs and Brushes

1. Overview

Clean room swabs and brushes are specialized tools designed for contamination control in controlled environments. They play a critical role in removing particulate and electrostatic discharge (ESD) hazards from sensitive surfaces in semiconductor manufacturing, pharmaceutical production, and aerospace engineering. These products must meet stringent ISO 14644-1 and IEST standards for particle generation, chemical compatibility, and electrostatic dissipation.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Foam-Tip Swabs High absorbency, low particle generation, non-abrasive Optical lens cleaning, precision electronics assembly
Microfiber Brushes Split-fiber structure for superior particle capture HEPA filter maintenance, cleanroom wall cleaning
ESD-Neutral Swabs Conductive carbon fibers, static-dissipative handles Wafer processing equipment cleaning, PCB assembly
Ultrasonic Clean Brushes Engineered for compatibility with ultrasonic cleaning systems Medical device sterilization, semiconductor tooling maintenance

3. Structure and Composition

Typical swabs consist of three primary components: (1) Cleaning medium (foam, microfiber, or nonwoven fabric), (2) Handle material (polypropylene, conductive polymer, or stainless steel), and (3) Bonding agent (solvent-free adhesive for ISO Class 3 environments). Brushes feature filament arrays (nylon with PTFE coating, carbon-infused polypropylene) mounted on ESD-safe polymer bases. All materials undergo outgassing testing per ASTM E595 standards.

4. Key Technical Specifications

Parameter Acceptance Criteria Importance
Particle Shedding (0.5 m+) <10 particles/cm Maintains ISO Class 3 environment integrity
ESD Decay Time <1.0 second Protects ESD-sensitive electronics
Chemical Extractables <0.01% by weight Prevents process contamination
Thermal Stability Operable from -40 C to 121 C Enables sterilization compatibility

5. Application Fields

Primary industries include: semiconductor fabrication (ASML immersion lithography tools), biopharmaceutical manufacturing (Grade A/B isolators), aerospace (NASA JPL Class 100 cleanrooms), and precision optics (Zeiss electron microscopes). Critical applications involve photomask cleaning, aseptic filling line maintenance, and MEMS device calibration.

6. Leading Manufacturers and Products

Manufacturer Key Product Technical Highlights
Texwipe TX1010 Cleanroom Swabs Gamma-stable polyester foam, 10-6 particle count
Aero-Mist ESD-700 Brush Kit Carbon-loaded nylon filaments, 108 surface resistance
Bondline Ultraclean Swabs Single-bonded PU tip, <1ppm NVR
Kimberly-Clark KimWipes CR-TX 99.99% isopropyl alcohol compatibility

7. Selection Recommendations

Key considerations include: (1) Surface sensitivity (e.g., 10nm particle removal efficiency for EUV lithography mirrors), (2) Chemical compatibility (resistance to 5% HF acid solutions), (3) ESD requirements (IEC 61340-5-1 compliance), and (4) Lifecycle cost (sterilization reusability vs. single-use economics). For critical applications like 5nm node manufacturing, carbon-fiber reinforced swabs with sub-100nm particle retention are recommended.

8. Industry Trends

Current developments focus on: (1) Nanofiber-based cleaning media with 99.999% BFE efficiency, (2) Smart brushes with embedded sensors for real-time contamination monitoring, (3) Biodegradable polymer handles reducing environmental impact, and (4) Integration with robotic cleaning systems for ISO Class 1 environments. The market is projected to grow at 8.7% CAGR through 2027, driven by 3D NAND flash manufacturing and biopharma single-use systems.

RFQ BOM Call Skype Email
Top