Clean Room Swabs and Brushes

Image Part Number Description / PDF Quantity Rfq
0037-04000

0037-04000

SIZE 4 TAKLON FLAT ARTIST; WD HD

0

414SSP

414SSP

SCRATCH BRUSH; SS FILL; WOOD HDL

0

1010CKG-12

1010CKG-12

APPLICATOR: HOG FILL; STL HNDL

0

0770-02000

0770-02000

SIZE 2 SABLE ROUND ARTIST; WD HD

0

23123

23123

SIZE 4 NYLON STRIP BRUSH, 2" HT

0

0688-00062

0688-00062

SIZE 5/8" OX HAIR ARTIST; WD HDL

0

WA12CKG-12

WA12CKG-12

APPLICATOR: HOG FILL; WOOD HNDL

0

SST2HHG-12

SST2HHG-12

APPLICATOR: HH FILL; SS HANDLE

0

0865-02000

0865-02000

SIZE 2 TAKLON LINE ARTIST; WD HD

0

SST10BG-12

SST10BG-12

APPLICATOR: BRASS FILL; SS HNDLE

0

414SSE

414SSE

SCRATCH BRUSH; SS FILL; WOOD HDL

0

499NADG-12

499NADG-12

APPLICATOR: NYL FILL; PLAST HNDL

0

1010SD

1010SD

APPLICATOR: SD NY FILL; STL HDL

0

PTA615

PTA615

1.5" CHIP BRUSH; POL FILL; PL HD

0

SST12CKG-12

SST12CKG-12

APPLICATOR: HOG FILL; SS HANDLE

0

36060ESD

36060ESD

ITW Chemtronics (Chemtronics)

SWAB SGL HEAD POLY KNIT 2500PC

0

855-144

855-144

MG Chemicals

BRUSH HORSE HAIR 1=144 PC BAG

96

444CS006G

444CS006G

PLATER'S BRUSH; CS FILL; WOOD HD

0

0770-03000

0770-03000

SIZE 3 SABLE ROUND ARTIST; WD HD

0

444BG

444BG

SCRATCH BRUSH; BRASS FILL; WD HD

0

Clean Room Swabs and Brushes

1. Overview

Clean room swabs and brushes are specialized tools designed for contamination control in controlled environments. They play a critical role in removing particulate and electrostatic discharge (ESD) hazards from sensitive surfaces in semiconductor manufacturing, pharmaceutical production, and aerospace engineering. These products must meet stringent ISO 14644-1 and IEST standards for particle generation, chemical compatibility, and electrostatic dissipation.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Foam-Tip Swabs High absorbency, low particle generation, non-abrasive Optical lens cleaning, precision electronics assembly
Microfiber Brushes Split-fiber structure for superior particle capture HEPA filter maintenance, cleanroom wall cleaning
ESD-Neutral Swabs Conductive carbon fibers, static-dissipative handles Wafer processing equipment cleaning, PCB assembly
Ultrasonic Clean Brushes Engineered for compatibility with ultrasonic cleaning systems Medical device sterilization, semiconductor tooling maintenance

3. Structure and Composition

Typical swabs consist of three primary components: (1) Cleaning medium (foam, microfiber, or nonwoven fabric), (2) Handle material (polypropylene, conductive polymer, or stainless steel), and (3) Bonding agent (solvent-free adhesive for ISO Class 3 environments). Brushes feature filament arrays (nylon with PTFE coating, carbon-infused polypropylene) mounted on ESD-safe polymer bases. All materials undergo outgassing testing per ASTM E595 standards.

4. Key Technical Specifications

Parameter Acceptance Criteria Importance
Particle Shedding (0.5 m+) <10 particles/cm Maintains ISO Class 3 environment integrity
ESD Decay Time <1.0 second Protects ESD-sensitive electronics
Chemical Extractables <0.01% by weight Prevents process contamination
Thermal Stability Operable from -40 C to 121 C Enables sterilization compatibility

5. Application Fields

Primary industries include: semiconductor fabrication (ASML immersion lithography tools), biopharmaceutical manufacturing (Grade A/B isolators), aerospace (NASA JPL Class 100 cleanrooms), and precision optics (Zeiss electron microscopes). Critical applications involve photomask cleaning, aseptic filling line maintenance, and MEMS device calibration.

6. Leading Manufacturers and Products

Manufacturer Key Product Technical Highlights
Texwipe TX1010 Cleanroom Swabs Gamma-stable polyester foam, 10-6 particle count
Aero-Mist ESD-700 Brush Kit Carbon-loaded nylon filaments, 108 surface resistance
Bondline Ultraclean Swabs Single-bonded PU tip, <1ppm NVR
Kimberly-Clark KimWipes CR-TX 99.99% isopropyl alcohol compatibility

7. Selection Recommendations

Key considerations include: (1) Surface sensitivity (e.g., 10nm particle removal efficiency for EUV lithography mirrors), (2) Chemical compatibility (resistance to 5% HF acid solutions), (3) ESD requirements (IEC 61340-5-1 compliance), and (4) Lifecycle cost (sterilization reusability vs. single-use economics). For critical applications like 5nm node manufacturing, carbon-fiber reinforced swabs with sub-100nm particle retention are recommended.

8. Industry Trends

Current developments focus on: (1) Nanofiber-based cleaning media with 99.999% BFE efficiency, (2) Smart brushes with embedded sensors for real-time contamination monitoring, (3) Biodegradable polymer handles reducing environmental impact, and (4) Integration with robotic cleaning systems for ISO Class 1 environments. The market is projected to grow at 8.7% CAGR through 2027, driven by 3D NAND flash manufacturing and biopharma single-use systems.

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